摘要:
Two or more switching devices (36) and two or more lead frames (41, 42, 43, and 44) are integrally molded by use of a molding resin (37) so that a power module (30) is formed; the power module (30) is made to adhere to a heat sink (32) via an insulating material (31); the power module (30) and the heat sink (32) are fixed to a housing (33) of the power module composite (23); the power module composite (23) is fixed to a case (6) of an electric rotating machine (1) via the housing (33).
摘要:
The rotary electric machine main body includes: a stator; a rotor that includes a rotating shaft and that is rotatable relative to the stator; and a supporting body that supports the stator and the rotor. The controlling apparatus includes a power circuit portion that is disposed around the rotating shaft, and that converts electric power that is received from the rotary electric machine main body or electric power that is supplied to the rotary electric machine main body between alternating current and direct current. The power circuit portion includes: a power module; and an electric power interconnecting part that includes a conductor that is connected to a terminal of the power module. The electric power interconnecting part is disposed so as to avoid overlapping with a region of the power module when the power circuit portion is viewed in an axial direction of the rotating shaft.
摘要:
A power module composite includes a power module (34) in which switching devices (32) included in an electric-power conversion circuit are molded, a driver module (37) that includes a control circuit (35) for controlling the switching devices (32) and is molded, a housing (39) containing the power module (34) and the driver module (37), and a heat sink (38) that is fixed to the housing (39) and refrigerates the switching devices (32); the power module 34 and the driver module 37 are mounted in that order on the heat sink (38) in such a way as to be superimposed on each other.
摘要:
The electric rotating machine is provided with an intermediate plate having a power circuit connection portion that is connected with an outgoing lead drawn out from a power circuit unit and an armature winding connection portion that is connected with the power circuit connection portion and an outgoing lead drawn out from an armature winding. The power circuit connection portion and the armature winding connection portion are arranged at desired positions and outgoing leads from the armature winding of the stator are drawn out in such a way as to fall within a given space, so that intermediate connection lines for connecting windings can be shortened. Accordingly, not only the breakage of an intermediate connection line caused by a vibration can be prevented, but also the switching elements can separately be arranged so as to reduce thermal interference between the switching elements; therefore, the switching elements can effectively be cooled.
摘要:
A dynamoelectric machine main body, power circuit modules and a field circuit module, and a control apparatus that has a heatsink that is prepared by die casting, and that is mounted integrally onto the dynamoelectric machine main body are included, the heatsink including a plurality of convex heat receiving portions that are disposed so as to project from a front surface of a base plate, and that have heat receiving surfaces, the power circuit modules and the field circuit module including seal main body portions that are constituted by an electrically insulating resin that seal switching elements so as to expose bottom surfaces of element heat radiating portions on reference surfaces that have a surface shape that corresponds to a shape of the heat receiving surfaces, and electrical insulation supporting layers being interposed between the bottom surfaces of the heat receiving surfaces and the element heat radiating portions.
摘要:
A dynamoelectric machine main body, power circuit modules and a field circuit module, and a control apparatus that has a heatsink that is prepared by die casting, and that is mounted integrally onto the dynamoelectric machine main body are included, the heatsink including a plurality of convex heat receiving portions that are disposed so as to project from a front surface of a base plate, and that have heat receiving surfaces, the power circuit modules and the field circuit module including seal main body portions that are constituted by an electrically insulating resin that seal switching elements so as to expose bottom surfaces of element heat radiating portions on reference surfaces that have a surface shape that corresponds to a shape of the heat receiving surfaces, and electrical insulation supporting layers being interposed between the bottom surfaces of the heat receiving surfaces and the element heat radiating portions.
摘要:
According to a power semiconductor device of the present invention, it comprises a plurality of lead frames formed into like a wiring pattern, a power semiconductor element joined onto the lead frame, and a capacitor placed between mutually adjacent two lead frames, and is encapsulated with a mold resin. The capacitor is characterized in that external electrodes of that capacitor are connected to the lead frames each through a stress-relaxation structure portion that is lower in rigidity than the capacitor.
摘要:
Provided is a rotary electric machine including housings, a stator, a rotor, bearings, a slip ring, a power assembly, a control assembly, a rotation sensor, and a brush holder, in which a switching element mounting surface of the power assembly and a surface of the control assembly, on which a control element of a control circuit is mounted, are placed in parallel to a rotation shaft, and the rotation sensor is placed between the rear bearing and the slip ring.
摘要:
The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.
摘要:
Two or more switching devices (36) and two or more lead frames (41, 42, 43, and 44) are integrally molded by use of a molding resin (37) so that a power module (30) is formed; the power module (30) is made to adhere to a heat sink (32) via an insulating material (31); the power module (30) and the heat sink (32) are fixed to a housing (33) of the power module composite (23); the power module composite (23) is fixed to a case (6) of an electric rotating machine (1) via the housing (33).