-
1.
公开(公告)号:US20050205205A1
公开(公告)日:2005-09-22
申请号:US11085430
申请日:2005-03-21
Applicant: Martin Kratzer , Bernd Heinz
Inventor: Martin Kratzer , Bernd Heinz
CPC classification number: G11B7/26 , G11B7/24038 , Y10T29/49821 , Y10T29/49822 , Y10T29/53683 , Y10T156/1126 , Y10T156/1132 , Y10T156/1939 , Y10T156/1944
Abstract: A method for separating bonded substrates and a respective apparatus used for that method is disclosed. The method comprises positioning the bonded substrates (1) in an evacuable chamber (2) by respective means, detaching a space (10) from that evacuable chamber by means of a sealing arrangement (4) so that said space comprises a partial area of the substrates with at least one gap (5) between the bonded substrates (1), lowering the pressure in the vacuum chamber (2) while maintaining the pressure in the space (10), thereby causing the bonded substrates to separate.
Abstract translation: 公开了一种用于分离粘结基片的方法和用于该方法的相应装置。 该方法包括通过相应的装置将接合的基板(1)定位在可抽空的室(2)中,借助于密封装置(4)将空间(10)从该可抽空腔中分离出来,使得所述空间包括 在所述接合的基板(1)之间具有至少一个间隙(5)的基板,同时在保持所述空间(10)中的压力的同时降低所述真空室(2)中的压力,从而使所述接合的基板分离。
-
2.
公开(公告)号:US07520954B2
公开(公告)日:2009-04-21
申请号:US11085430
申请日:2005-03-21
Applicant: Martin Kratzer , Bernd Heinz
Inventor: Martin Kratzer , Bernd Heinz
IPC: B32B38/10
CPC classification number: G11B7/26 , G11B7/24038 , Y10T29/49821 , Y10T29/49822 , Y10T29/53683 , Y10T156/1126 , Y10T156/1132 , Y10T156/1939 , Y10T156/1944
Abstract: A method for separating bonded substrates and a respective apparatus used for that method is disclosed. The method comprises positioning the bonded substrates (1) in an evacuable chamber (2) by respective means, detaching a space (10) from that evacuable chamber by means of a sealing arrangement (4) so that said space comprises a partial area of the substrates with at least one gap (5) between the bonded substrates (1), lowering the pressure in the vacuum chamber (2) while maintaining the pressure in the space (10), thereby causing the bonded substrates to separate.
Abstract translation: 公开了一种用于分离粘结基片的方法和用于该方法的相应装置。 该方法包括通过相应的装置将接合的基板(1)定位在可抽空的室(2)中,借助于密封装置(4)将空间(10)从该可抽空腔中分离出来,使得所述空间包括 在所述接合的基板(1)之间具有至少一个间隙(5)的基板,同时在保持所述空间(10)中的压力的同时降低所述真空室(2)中的压力,从而使所述接合的基板分离。
-
公开(公告)号:US20100126853A1
公开(公告)日:2010-05-27
申请号:US12623573
申请日:2009-11-23
Applicant: Martin Kratzer
Inventor: Martin Kratzer
IPC: C23C14/44
CPC classification number: H01J37/3408 , H01J37/3438
Abstract: Apparatus for sputtering comprises a vacuum chamber defined by at least one side wall, a base and a cover, at least one first electrode having a surface arranged in the vacuum chamber, a counter electrode having a surface arranged in the vacuum chamber and a RF generator. The RF generator is configured to apply a RF electric field across the at least one first electrode and the counter electrode so as to ignite a plasma between the first electrode and the counter electrode. The counter electrode comprises at least a portion of the side wall and/or the base of the vacuum chamber and an additional electrically conductive member. The additional electrically conductive member comprises at least two surfaces arranged generally parallel to one another and spaced at a distance from one another.
Abstract translation: 用于溅射的装置包括由至少一个侧壁,基部和盖子限定的真空室,具有布置在真空室中的表面的至少一个第一电极,具有布置在真空室中的表面的对电极和RF发生器 。 RF发生器被配置为在所述至少一个第一电极和对电极之间施加RF电场,以点燃第一电极和对电极之间的等离子体。 对电极包括真空室的侧壁和/或基底的至少一部分和附加的导电构件。 附加的导电构件包括至少两个彼此平行布置且间隔彼此间隔开的表面。
-
公开(公告)号:US10224188B2
公开(公告)日:2019-03-05
申请号:US12623573
申请日:2009-11-23
Applicant: Martin Kratzer
Inventor: Martin Kratzer
IPC: H01J37/34
Abstract: Apparatus for sputtering comprises a vacuum chamber defined by at least one side wall, a base and a cover, at least one first electrode having a surface arranged in the vacuum chamber, a counter electrode having a surface arranged in the vacuum chamber and a RF generator. The RF generator is configured to apply a RF electric field across the at least one first electrode and the counter electrode so as to ignite a plasma between the first electrode and the counter electrode. The counter electrode comprises at least a portion of the side wall and/or the base of the vacuum chamber and an additional electrically conductive member. The additional electrically conductive member comprises at least two surfaces arranged generally parallel to one another and spaced at a distance from one another.
-
-
-