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公开(公告)号：US12186786B2
公开(公告)日：2025-01-07
申请号：US17422765
申请日：2020-02-21
Applicant: MITSUBISHI MATERIALS CORPORATION
Inventor： Shu Muraoka , Hiroshi Hayashi , Shota Nakayama , Yusuke Kimura
IPC: B09B3/25 , B02C18/00 , B02C23/08 , B07C5/06 , B07C5/342 , B07C5/344 , B09B3/40 , B09B101/17 , H05K3/22
Abstract: A method for treating waste printed circuit board includes carbonizing waste printed circuit board together with a calcium compound at 400° C. to 600° C. in a non-oxidizing atmosphere to fix a halogen contained in the board as calcium halide and to melt a solder of the board to allow mounted parts to be easily separated from the board, performing crushing after the carbonizing, and sieving crushed materials into fine particles of less than 0.5 mm containing the calcium compounds, medium particles containing the mounted parts, and coarse particles containing board pieces such that the crushed materials are sorted into the calcium compounds, the mounted parts, and the board pieces.
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公开(公告)号：US20140004382A1
公开(公告)日：2014-01-02
申请号：US13926210
申请日：2013-06-25
Applicant: MITSUBISHI MATERIALS CORPORATION
Inventor： Kenichi Yamaguchi , Yusuke Kimura
CPC classification number: F27D1/0006 , F23M5/00 , F23M2900/05004 , F27D1/1684 , Y10T428/325
Abstract: The corrosion-resistant brick is a corrosion-resistant brick obtained by, in an Al—Cr-based brick, an Al—Mg-based brick and a Cr—Mg-based brick, providing a layer of magnetite powder on a brick surface, and heating and melting the magnetite powder so as to react the respective components of the brick with Fe, thereby forming a coating layer which is a ternary oxide of the brick components and Fe, and is made of a spinel solid solution having a melting point of 1600° C. or higher.
Abstract translation: 耐腐蚀砖是通过在Al-Cr系砖中形成Al-Mg系砖和Cr-Mg系砖而得到的耐腐蚀砖，在砖面上形成一层磁铁矿粉末， 对该磁铁矿粉进行加热熔融，使砖的各成分与Fe反应，由此形成作为砖成分的三元氧化物的Fe和Fe，并且由熔点为 1600℃以上。
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公开(公告)号：US20220062962A1
公开(公告)日：2022-03-03
申请号：US17422765
申请日：2020-02-21
Applicant: MITSUBISHI MATERIALS CORPORATION
Inventor： Shu Muraoka , Hiroshi Hayashi , Shota Nakayama , Yusuke Kimura
Abstract: A method for treating waste printed circuit board includes carbonizing waste printed circuit board together with a calcium compound at 400° C. to 600° C. in a non-oxidizing atmosphere to fix a halogen contained in the board as calcium halide and to melt a solder of the board to allow mounted parts to be easily separated from the board, performing crushing after the carbonizing, and sieving crushed materials into fine particles of less than 0.5 mm containing the calcium compounds, medium particles containing the mounted parts, and coarse particles containing board pieces such that the crushed materials are sorted into the calcium compounds, the mounted parts, and the board pieces.
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