公开(公告)号：US12186786B2

公开(公告)日：2025-01-07

申请号：US17422765

申请日：2020-02-21

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Shu Muraoka ,  Hiroshi Hayashi ,  Shota Nakayama ,  Yusuke Kimura

IPC: B09B3/25 ,  B02C18/00 ,  B02C23/08 ,  B07C5/06 ,  B07C5/342 ,  B07C5/344 ,  B09B3/40 ,  B09B101/17 ,  H05K3/22

Abstract: A method for treating waste printed circuit board includes carbonizing waste printed circuit board together with a calcium compound at 400° C. to 600° C. in a non-oxidizing atmosphere to fix a halogen contained in the board as calcium halide and to melt a solder of the board to allow mounted parts to be easily separated from the board, performing crushing after the carbonizing, and sieving crushed materials into fine particles of less than 0.5 mm containing the calcium compounds, medium particles containing the mounted parts, and coarse particles containing board pieces such that the crushed materials are sorted into the calcium compounds, the mounted parts, and the board pieces.

公开(公告)号：US20230166970A1

公开(公告)日：2023-06-01

申请号：US17913234

申请日：2021-03-22

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Koya Arai ,  Chompunoot Wiraseranee ,  Shota Nakayama

IPC: C01B19/00 ,  H10N10/852

CPC classification number: C01B19/002 ,  H10N10/852 ,  C01P2002/54 ,  C01P2006/40 ,  C01P2006/32

Abstract: There is provided a thermoelectric conversion material containing Cu and Se as main components, an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and optional element of Te. The thermoelectric conversion material is represented by the following chemical formula. Chemical Formula: CuxSe(1−y)TeyMz,


1.95≤x

公开(公告)号：US20220062962A1

公开(公告)日：2022-03-03

申请号：US17422765

申请日：2020-02-21

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Shu Muraoka ,  Hiroshi Hayashi ,  Shota Nakayama ,  Yusuke Kimura

IPC: B09B3/00 ,  H05K3/22 ,  B02C18/00 ,  B02C23/08 ,  B07C5/06 ,  B07C5/342 ,  B07C5/344

Abstract: A method for treating waste printed circuit board includes carbonizing waste printed circuit board together with a calcium compound at 400° C. to 600° C. in a non-oxidizing atmosphere to fix a halogen contained in the board as calcium halide and to melt a solder of the board to allow mounted parts to be easily separated from the board, performing crushing after the carbonizing, and sieving crushed materials into fine particles of less than 0.5 mm containing the calcium compounds, medium particles containing the mounted parts, and coarse particles containing board pieces such that the crushed materials are sorted into the calcium compounds, the mounted parts, and the board pieces.