Invention Publication
- Patent Title: THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE
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Application No.: US17913234Application Date: 2021-03-22
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Publication No.: US20230166970A1Publication Date: 2023-06-01
- Inventor: Koya Arai , Chompunoot Wiraseranee , Shota Nakayama
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 20057017 2020.03.27
- International Application: PCT/JP2021/011715 2021.03.22
- Date entered country: 2022-09-21
- Main IPC: C01B19/00
- IPC: C01B19/00 ; H10N10/852
Abstract:
There is provided a thermoelectric conversion material containing Cu and Se as main components, an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and optional element of Te. The thermoelectric conversion material is represented by the following chemical formula. Chemical Formula: CuxSe(1−y)TeyMz,
1.95≤x
1.95≤x
Information query
