Flow path switching type collecting apparatus of by-product for semiconductor manufacturing process

    公开(公告)号:US11173439B2

    公开(公告)日:2021-11-16

    申请号:US16677640

    申请日:2019-11-07

    Abstract: The flow path switching type collecting apparatus of by-products for a semiconductor manufacturing process of the present disclosure includes: a cylindrical housing that has a top plate having a gas inlet and a bottom plate having a gas outlet and fastening portions extending and protruding inside the housing, and receives and then discharges an exhaust gas flowing inside; and a flow path switching type disc collection tower that is installed vertically in the housing and includes an open edge-mesh center type collection disc, a mesh edge-open center type collection disc, a solid edge-open center type collection disc, and an open edge-solid center type collection disc that have different external shape to collect by-products of an exhaust gas flowing insides.

    Apparatus for collecting by-product in semiconductor process

    公开(公告)号:US10801107B2

    公开(公告)日:2020-10-13

    申请号:US16234372

    申请日:2018-12-27

    Abstract: Disclosed is an apparatus for collecting a by-product in a semiconductor process, the apparatus including: a housing; a heater plate; a heater power supply unit; first and second upper horizontal brackets collecting a by-product; a by-product collecting tower allowing the exhaust gas to pass through an exhaust gas passing space and collecting the by-product; the lower horizontal bracket guiding the exhaust gas toward the window and collecting the by-product contained in the exhaust gas; the window blocking the powder form by-product from introducing to a gas collecting and discharging port and guiding the exhaust gas thereto; and the gas collecting and discharging port. Accordingly, the apparatus can increase capacity of collecting a by-product with a simple structure, thereby extending a replacement period of the apparatus. In addition, the apparatus can collect a large amount of by-products quickly and efficiently over a long period of time.

    Apparatus for collecting by-product in semiconductor manufacturing process

    公开(公告)号:US11562943B2

    公开(公告)日:2023-01-24

    申请号:US16669824

    申请日:2019-10-31

    Abstract: ABSTRACT An apparatus is for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing cooling channel on an inner wall thereof to cool exhaust gas which is temperature-controlled by a heater while being introduced through a gas inlet of an upper plate; an internal collecting tower including multiple vertical plates and multiple horizontal plates that are assembled, and condensing and collecting a by-product from the exhaust gas; a main cooling channel having a serpentine shape and cooling the exhaust gas uniformly by using coolant while passing through the internal collecting tower; and a multi-connection pipe sequentially supplying the coolant to the upper plate cooling channel, the housing cooling channel, and the main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe that are provided outside the housing.

    Apparatus having cooling line for collecting by-product in semiconductor manufacturing process

    公开(公告)号:US11462422B2

    公开(公告)日:2022-10-04

    申请号:US16668205

    申请日:2019-10-30

    Abstract: Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing (110) including an inner wall plate (111) on an inner wall thereof to collect a by-product while generating a vortex in exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including vertical plates, an upper cover plate, and vortex plates fitted to the vertical plates, and condensing the introduced exhaust gas to collect the by-product; a main cooling channel (160) cooling the exhaust gas by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to an upper plate cooling channel and a main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe provided outside the housing.

    APPARATUS HAVING COOLING LINE FOR COLLECTING BY-PRODUCT IN SEMICONDUCTOR MANUFACTURING PROCESS

    公开(公告)号:US20210134701A1

    公开(公告)日:2021-05-06

    申请号:US16669824

    申请日:2019-10-31

    Abstract: Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing cooling channel (111) on an inner wall thereof to cooling exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including multiple vertical plates and multiple horizontal plates that are assembled, and condensing and collecting a by-product from the exhaust gas; a main cooling channel (160) having a serpentine shape and cooling the exhaust gas uniformly by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to the upper plate cooling channel, the housing cooling channel, and the main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe that are provided outside the housing.

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