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公开(公告)号:US09610174B2
公开(公告)日:2017-04-04
申请号:US14335251
申请日:2014-07-18
发明人: Wei-Ching Wang , Yen-Nien Chen , Tzyy-Ker Sue , For-Son Wang , Wei-Jen Shih , Wei-Te Chen
IPC分类号: A61F2/44 , B22F3/11 , B22F7/06 , C22C1/04 , A61L27/04 , A61L27/56 , B22F3/10 , B22F5/00 , A61F2/30
CPC分类号: A61F2/447 , A61F2002/30011 , A61F2002/30957 , A61F2002/30968 , A61F2002/4475 , A61F2310/00011 , A61F2310/00023 , A61L27/04 , A61L27/56 , A61L2430/38 , B22F3/10 , B22F3/1109 , B22F3/1121 , B22F5/00 , B22F7/06 , C22C1/0458
摘要: An intervertebral implant is a porous structure formed of a plurality of metal balls, and the intervertebral implant includes a bone support area and a bone growth area. The bone support area and the bone growth area each have a plurality of connecting holes, and a porosity of the bone support area is smaller than that of the bone growth area.