公开(公告)号：US20200381365A1

公开(公告)日：2020-12-03

申请号：US16994764

申请日：2020-08-17

Applicant: MEDIATEK Inc.

Inventor： Wen-Sung HSU ,  Tao CHENG ,  Nan-Cheng CHEN ,  Che-Ya CHOU ,  Wen-Chou WU ,  Yen-Ju LU ,  Chih-Ming HUNG ,  Wei-Hsiu HSU

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L23/31 ,  H01L25/065 ,  H01L25/16 ,  H01L23/50 ,  H01L23/498 ,  H01L21/683 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/22

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US20190051609A1

公开(公告)日：2019-02-14

申请号：US16163614

申请日：2018-10-18

Applicant: MEDIATEK Inc.

Inventor： Wen-Sung HSU ,  Tao CHENG ,  Nan-Cheng CHEN ,  Che-Ya CHOU ,  Wen-Chou WU ,  Yen-Ju LU ,  Chih-Ming HUNG ,  Wei-Hsiu HSU

IPC: H01L23/538 ,  H01L25/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US20250007641A1

公开(公告)日：2025-01-02

申请号：US18756009

申请日：2024-06-27

Applicant: MEDIATEK INC.

Inventor： Ding-Yuh HWANG ,  Wei-Hsiu HSU ,  Jun-Wei LIN ,  Zih-Yin DING ,  Chia-Ning CHANG ,  Chao-Wei HUANG

IPC: H04L1/00 ,  H04L1/08 ,  H04L27/36 ,  H04W8/22 ,  H04W84/12

Abstract: A Wi-Fi communication method includes: after a predetermined idle period, switching from a first mode into a second mode, wherein the first mode having a first capability, and the second mode having a second capability different from the first capability; in response to failure of decoding a first data packet, switching from the second mode into the first mode; and receiving and decoding a second data packet in the first mode, wherein the first data packet is retransmitted as the second data packet.