公开(公告)号：US20230060065A1

公开(公告)日：2023-02-23

申请号：US17872005

申请日：2022-07-25

Applicant: MEDIATEK INC.

Inventor： Yi-Lin Tsai ,  Yi-Jou Lin ,  Tsai-Ming Lai ,  Wei-Chen Chang

IPC: H01L23/043 ,  H01L23/06 ,  H01L23/00

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The two-part lid comprises an annular lid base and a cover plate removably installed on the annular lid base.