公开(公告)号：US20240006278A1

公开(公告)日：2024-01-04

申请号：US18200590

申请日：2023-05-23

Applicant: MEDIATEK INC.

Inventor： Hsin-Long Chen ,  Chin-Chiang Chang

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/31 ,  H10B80/00 ,  H01L23/00

CPC classification number: H01L23/49805 ,  H01L25/0657 ,  H01L23/3107 ,  H10B80/00 ,  H01L24/48 ,  H01L24/73 ,  H01L24/32 ,  H01L24/16 ,  H01L24/45 ,  H01L2924/1436 ,  H01L2224/32245 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48011 ,  H01L2224/13147 ,  H01L2924/1433

Abstract: A multi-die QFN hybrid package includes a carrier having flip-chip leads and wire-bonding leads. A first die and a second die are mounted on the flip-chip leads, respectively, in a flip-chip manner. The first die is spaced apart from the second die. A third die is stacked over the first die and the second die. The third die is electrically connected to the wire-bonding leads around the first die and the second die through bond wires. A mold cap encapsulates the first die, the second die, the third die, the bond wires, and partially encapsulates the carrier. The flip-chip leads and the wire-bonding leads are exposed from a bottom mold cap surface.