公开(公告)号：US09660017B2

公开(公告)日：2017-05-23

申请号：US14925995

申请日：2015-10-29

Applicant: MEDIATEK INC.

Inventor： Chao-Yang Yeh ,  Chee-Kong Ung ,  Tzu-Hung Lin ,  Jia-Wei Fang

IPC: H01L23/34 ,  H01L49/02 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L28/40 ,  H01L23/3157 ,  H01L23/49816 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/16 ,  H01L28/10 ,  H01L28/20 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/014

Abstract: A microelectronic package includes a packaging substrate having a chip mounting surface; a chip mounted on the chip mounting surface of the packaging substrate with the chip's active surface facing down to the chip mounting surface; a plurality of input/output (I/O) pads distributed on the active surface of the chip; and a discrete passive element mounted on the active surface of the chip. The discrete passive element may be a decoupling capacitor, a resistor, or an inductor.

公开(公告)号：US20160211318A1

公开(公告)日：2016-07-21

申请号：US14925995

申请日：2015-10-29

Applicant: MEDIATEK INC.

Inventor： Chao-Yang Yeh ,  Chee-Kong Ung ,  Tzu-Hung Lin ,  Jia-Wei Fang

IPC: H01L49/02 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L28/40 ,  H01L23/3157 ,  H01L23/49816 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/16 ,  H01L28/10 ,  H01L28/20 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/014

Abstract: A microelectronic package includes a packaging substrate having a chip mounting surface; a chip mounted on the chip mounting surface of the packaging substrate with the chip's active surface facing down to the chip mounting surface; a plurality of input/output (I/O) pads distributed on the active surface of the chip; and a discrete passive element mounted on the active surface of the chip. The discrete passive element may be a decoupling capacitor, a resistor, or an inductor.

Abstract translation: 微电子封装包括具有芯片安装表面的封装衬底; 芯片安装在封装基板的芯片安装表面上，芯片的有源表面朝向芯片安装表面; 分布在芯片的有源表面上的多个输入/输出（I / O）焊盘; 以及安装在芯片的有源表面上的分立无源元件。 分立无源元件可以是去耦电容器，电阻器或电感器。