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公开(公告)号:US20220195136A1
公开(公告)日:2022-06-23
申请号:US17644751
申请日:2021-12-16
发明人: Kazuaki YAMAMOTO , Shinji KADOSHIMA , Hiroyuki KOGA , Kazuyuki NEGISHI , Masahiko MINEMURA , Koichi HIGUCHI
摘要: In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R1SiO3/2 unit (a T unit), a R2R3SiO2/2 unit (a D unit), and a R4R5R6SiO1/2 unit (a M unit) (in each unit, R1 to R6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.
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公开(公告)号:US20220177320A1
公开(公告)日:2022-06-09
申请号:US17594379
申请日:2020-04-15
IPC分类号: C01B33/18 , C09D183/04 , C09D7/62 , C09D7/40
摘要: A heat insulating layer contains many hollow particles, a silicone-based resin binder, and silica nanoparticle. The percentage of the silica nanoparticles in the total amount of the resin binder and the silica nanoparticles is equal to or greater than 10% by volume and equal to or smaller than 55% by volume.
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