公开(公告)号：US20230261437A1

公开(公告)日：2023-08-17

申请号：US17806991

申请日：2022-06-15

Applicant: Lumentum Operations LLC

Inventor： ZiWen DONG ,  Hery DJIE ,  Anuj MADARIA ,  Yutong LI ,  Ran HUANG

IPC: H01S5/028 ,  H01S5/02 ,  H01S5/40

CPC classification number: H01S5/0287 ,  H01S5/0202 ,  H01S5/4025

Abstract: In some implementations, a microruler is patterned on a surface of a wafer to enable visual overspray screening and/or quantitative measurement. For example, a laser bar cleaved from a wafer may comprise multiple laser devices that each include a first facet and a second facet, an anti-reflective (AR) coating applied to the first facet, and a highly reflective (HR) coating applied to the second facet. Furthermore, a set of microrulers may be patterned on a surface of the laser bar, where each microruler in the set of microrulers is aligned with a bar cleaving line where the laser bar was cleaved from the wafer, and each microruler has multiple graduation markings that each represent a respective distance from the bar cleaving line such that the graduation markings can be used to quantitatively measure an overspray of the AR coating or the HR coating relative to the bar cleaving line.