公开(公告)号：US11152525B2

公开(公告)日：2021-10-19

申请号：US15986356

申请日：2018-05-22

Applicant: LG ELECTRONICS INC.

Inventor： Joonhan Kwon ,  Hyeyoung Yang ,  Bojoong Kim

IPC: H01L21/66 ,  H01L21/28 ,  H01L29/94 ,  H01L29/78 ,  H01L31/05 ,  H01L31/0224 ,  H01L31/048 ,  H01L31/068 ,  H01L31/0216 ,  H01L31/049

Abstract: A solar cell module includes solar cells each including a semiconductor substrate and first and second electrodes that extend in a first direction on a surface of the semiconductor substrate and have different polarities; conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate included in each solar cell and connected to the first electrodes or the second electrodes through a conductive adhesive; and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and temporarily fixing the conductive lines to the semiconductor substrate and the first and second electrodes, the insulating adhesive portion being attached on a back surface of least a portion of each conductive line as well as a side surface of at least a portion of each conductive line.

公开(公告)号：US10002985B2

公开(公告)日：2018-06-19

申请号：US15261365

申请日：2016-09-09

Applicant: LG ELECTRONICS INC.

Inventor： Joonhan Kwon ,  Hyeyoung Yang ,  Bojoong Kim

IPC: B21D53/06 ,  H01L31/05 ,  H01L31/0224 ,  H01L31/048 ,  H01L31/068 ,  H01L31/049 ,  H01L31/0216

CPC classification number: H01L31/0516 ,  H01L31/0216 ,  H01L31/02245 ,  H01L31/022458 ,  H01L31/0481 ,  H01L31/049 ,  H01L31/0512 ,  H01L31/0682 ,  Y02E10/547 ,  Y10T29/49355

Abstract: A solar cell module and a method for manufacturing the same are disclosed. The solar cell module includes solar cells each including a semiconductor substrate, and first electrodes and second electrodes extending in a first direction on a surface of the semiconductor substrate, conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate and connected to the first electrodes or the second electrodes through a conductive adhesive, and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and fixing the conductive lines to the semiconductor substrate and the first and second electrodes. The insulating adhesive portion is attached up to an upper part and a side of at least a portion of each conductive line.