公开(公告)号：US20160093596A1

公开(公告)日：2016-03-31

申请号：US14867297

申请日：2015-09-28

Applicant: LG DISPLAY CO., LTD.

Inventor： Ju Ik HONG ,  Jeong Kweon PARK ,  Sang Ryeon PARK ,  Yong Soo KIM ,  Jang Cheol KIM ,  Ik Hyun KUON

IPC: H01L25/16 ,  H01L25/00 ,  H01L27/12

Abstract: Disclosed are a display apparatus, where a component disposition area facing a component disposed on a lower end of a non-display area of a panel is removed in a lower substrate configuring the panel, and a method of manufacturing the same.

Abstract translation: 公开了一种显示装置，其中面向设置在面板的非显示区域的下端上的部件的部件布置区域在构成面板的下基板中被去除，及其制造方法。

公开(公告)号：US20180097018A1

公开(公告)日：2018-04-05

申请号：US15674288

申请日：2017-08-10

Applicant: LG DISPLAY CO., LTD.

Inventor： Ik Hyun KUON ,  Jeong Kweon PARK ,  Ju Ik HONG ,  Jangcheol KIM ,  Jinwook KWAK

IPC: H01L27/12 ,  H01L21/67 ,  B24D5/00

CPC classification number: H01L27/1218 ,  B24B9/08 ,  B24D5/00 ,  B24D2203/00 ,  H01L21/67092 ,  H01L27/1262 ,  H01L27/3244 ,  H01L51/0096

Abstract: Various embodiments provide a substrate processing apparatus for grinding a substrate, and a display device including a substrate in which a hole is formed in an edge of the substrate using the substrate processing apparatus. The substrate processing apparatus for processing a display substrate includes a body which, in operation, rotates, a cylindrical grinding part connected to the body, and a lateral groove formed in a surface of the cylindrical grinding part. The lateral groove is configured to accommodate the display substrate. Thus, it is possible to form a hole by grinding an edge of the display substrate so as to be matched with a designed value.

公开(公告)号：US20190189448A1

公开(公告)日：2019-06-20

申请号：US16283392

申请日：2019-02-22

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon PARK ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung CHOI ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  H01L21/02 ,  B24B19/02 ,  B26F1/16

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

公开(公告)号：US20180019126A1

公开(公告)日：2018-01-18

申请号：US15640951

申请日：2017-07-03

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon PARK ,  Jeong Joon LEE ,  Ju Ik HONG ,  Sang Chul LEE ,  Jangcheol KIM ,  Ik Hyun KUON ,  Tagyoung CHOI ,  Jinwook KWAK

IPC: H01L21/20 ,  H01L21/02 ,  B26F1/16 ,  H01L31/18 ,  B24B19/02

CPC classification number: H01L21/2007 ,  B24B19/02 ,  B26F1/16 ,  H01L21/02063 ,  H01L31/182

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.