公开(公告)号：US10509425B2

公开(公告)日：2019-12-17

申请号：US15411389

申请日：2017-01-20

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Jorge Jose Zaninovich ,  Fred Egley

IPC: G05D23/19 ,  H01L21/67

Abstract: A temperature controller for a substrate support in a substrate processing system includes memory that stores a first model correlating temperatures of a plurality of first thermal control elements (TCEs) arranged in the substrate support and first temperature responses of the substrate support. The first temperature responses correspond to locations on a surface of the substrate support. A temperature estimation module calculates resistances of the first TCEs, determines, based on the calculated resistances, the temperatures of the first TCEs, and estimates, using the stored first model and the determined temperatures of the first TCEs, an actual temperature response of the substrate support. The temperature controller is configured to control the first TCEs based on the actual temperature response of the substrate support.

公开(公告)号：US11901944B2

公开(公告)日：2024-02-13

申请号：US17617517

申请日：2020-06-08

Applicant: LAM RESEARCH CORPORATION

Inventor： Changyou Jing ,  Fred Egley

IPC: H04B10/25 ,  H01J37/32 ,  H04B10/564 ,  H04B10/80

CPC classification number: H04B10/2589 ,  H01J37/32935 ,  H04B10/564 ,  H04B10/807

Abstract: A substrate support assembly comprises a first optical receiver, a power converter, a first circuit, and a first optical transmitter, all embedded in the substrate support assembly. The first optical receiver is configured to receive a first optical signal and a first optical data through a fiber optic cable. The power converter is configured to generate DC power based on the first optical signal and the first optical data received by the first optical receiver. The first circuit is configured to receive the DC power from the power converter and to receive a second data from a sensor disposed in the substrate support assembly in response to the first optical data. The first optical transmitter is configured to transmit the second data as a second optical data through the fiber optic cable.

公开(公告)号：US20180210473A1

公开(公告)日：2018-07-26

申请号：US15411389

申请日：2017-01-20

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Jorge Jose Zaninovich ,  Fred Egley

IPC: G05D23/19 ,  G05B17/02

Abstract: A temperature controller for a substrate support in a substrate processing system includes memory that stores a first model correlating temperatures of a plurality of first thermal control elements (TCEs) arranged in the substrate support and first temperature responses of the substrate support. The first temperature responses correspond to locations on a surface of the substrate support. A temperature estimation module calculates resistances of the first TCEs, determines, based on the calculated resistances, the temperatures of the first TCEs, and estimates, using the stored first model and the determined temperatures of the first TCEs, an actual temperature response of the substrate support. The temperature controller is configured to control the first TCEs based on the actual temperature response of the substrate support.