公开(公告)号：US20230245862A1

公开(公告)日：2023-08-03

申请号：US18013347

申请日：2022-06-15

Applicant: LAM RESEARCH CORPORATION

Inventor： Anthony John RICCI ,  Ramon Liwanag BUAN ,  Wayne Edward RICHTER ,  Christopher J. PENA ,  Marissa Elena Ortiz AMAYA

IPC: H01J37/32

CPC classification number: H01J37/32449 ,  H01J37/32834 ,  H01J37/32899 ,  H01J37/32357 ,  H01J2237/182 ,  H01J2237/186 ,  H01J2237/334 ,  H01J2237/24585

Abstract: A gas delivery system for substrate processing tool includes a first gas box configured to supply a first gas mixture including one or more gases selected from a first set of N gases to a first substrate processing chamber, where N is an integer greater than one. A second gas box is configured to selectively supply a second gas mixture including one or more gases selected from a second set of M gases to a second substrate processing chamber, where M is an integer greater than one. A third gas box is configured to supply a third gas to the first substrate processing chamber at a first concentration and to supply the third gas to the second substrate processing chamber at a second concentration. The third gas is incompatible with one or more gases in the first set of N gases and with one or more gas in the second set of M gases.

公开(公告)号：US20230127806A1

公开(公告)日：2023-04-27

申请号：US17914499

申请日：2020-03-27

Applicant: LAM RESEARCH CORPORATION

Inventor： Anthony John RICCI ,  Keith GAFF

IPC: H01J37/32

Abstract: A substrate processing system includes: a substrate support within a processing chamber to vertically support a substrate; a temperature probe including: a first temperature sensor to measure a first temperature of the substrate support; a second temperature sensor to measure a second temperature of the substrate support; a third temperature sensor to measure a third temperature of the substrate support; and a fourth temperature sensor to measure a fourth temperature of the substrate support; a temperature module to: in a first state, determine a substrate support temperature of the substrate support based on the first, second, third, and fourth temperatures; in a second state, determine the substrate support temperature based on only three of the first, second, third, and fourth temperatures; and a temperature control module configured to control at least one of heating and cooling of the substrate support based on the substrate support temperature.