公开(公告)号：US11744022B2

公开(公告)日：2023-08-29

申请号：US17536429

申请日：2021-11-29

申请人： Kyocera AVX Components (San Diego), Inc.

发明人： Seung Hyuk Choi ,  Hyun Jun Hong ,  Tae Wook Kim ,  Cheong Ho Ryu ,  Young Sang Kim ,  Sung Jun Kim

IPC分类号： H05K3/46 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42

CPC分类号： H05K3/0026 ,  H05K3/0014 ,  H05K3/185 ,  H05K3/188 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0582 ,  H05K2203/0588 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.