公开(公告)号：US20070007344A1

公开(公告)日：2007-01-11

申请号：US11478645

申请日：2006-07-03

申请人： Kosuke Inoue ,  Hiroshi Homma ,  Hitoshi Odashima ,  Naoya Kanda ,  Kie Ueda

发明人： Kosuke Inoue ,  Hiroshi Homma ,  Hitoshi Odashima ,  Naoya Kanda ,  Kie Ueda

IPC分类号： G06K7/00

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/81191 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： In an RFID (radio frequency identification) tag comprising an antenna formed of a conductive paste containing conductive filler like silver flakes on a base member, and an RFID chip connected to the antenna, the present invention cures a pattern of the antenna formed of the conductive paste, and then connects the RFID chip to the antenna with thermoplastic resin contained in the conductive paste by heating bump electrodes of the RFID chip in contact with the antenna. According to the present invention, Since the bump electrodes of the RFID chip and the antenna are connected to each other and establish sufficient electrical conduction therebetween without providing an anisotropic conductive sheet or the like therebetween, a highly reliable RFID tag is supplied at a low cost.

摘要翻译： 在包含天线形成的RFID（射频识别）标签中，该天线由包含导电填料，如在基底构件上的银薄片形成的导电膏形成，以及连接到天线的RFID芯片，本发明固化由导电材料形成的天线的图案 然后通过加热与天线接触的RFID芯片的凸起电极，将RFID芯片与包含在导电浆料中的热塑性树脂连接到天线。 根据本发明，由于RFID芯片和天线的凸起电极彼此连接并且在它们之间建立足够的导电，而不在其间提供各向异性导电片等，所以以低成本提供高可靠性的RFID标签 。

公开(公告)号：US06589802B1

公开(公告)日：2003-07-08

申请号：US09640647

申请日：2000-08-18

申请人： Toyoki Asada ,  Yuji Fujita ,  Kie Ueda ,  Naoya Kanda ,  Mari Matsuyoshi

发明人： Toyoki Asada ,  Yuji Fujita ,  Kie Ueda ,  Naoya Kanda ,  Mari Matsuyoshi

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0783 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.

摘要翻译： 本发明可以容易地去除半导体集成电路芯片并确保倒装芯片接合的可靠性的结构，电子部件的封装方法以及用于分离电子部件的方法和装置。 根据本发明，目的是通过使用两种用于粘合半导体集成电路芯片和电路板的可溶性和不溶性树脂的倒装芯片接合结构来实现的。