公开(公告)号：US20170118836A1

公开(公告)日：2017-04-27

申请号：US15301341

申请日：2015-04-01

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H05K1/09 ,  C09D11/037 ,  H01B1/22 ,  B22F1/00 ,  H05K3/22 ,  H05K3/02 ,  B22F1/02 ,  C09D11/52 ,  H05K3/12

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent

公开(公告)号：US20180376593A1

公开(公告)日：2018-12-27

申请号：US16118212

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  H05K3/12 ,  H05K3/02 ,  C09D11/037 ,  H01B1/20 ,  C09D11/52 ,  B22F9/24 ,  H01B1/22 ,  H05K3/22

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：US10477681B2

公开(公告)日：2019-11-12

申请号：US16118212

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H01B1/20 ,  H05K1/00 ,  C09D5/24 ,  H05K1/09 ,  B22F9/24 ,  C09D11/52 ,  H01B1/22 ,  B22F1/00 ,  B22F1/02 ,  C09D11/037 ,  H05K3/02 ,  H05K3/12 ,  H05K3/22

Abstract: The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：US10477680B2

公开(公告)日：2019-11-12

申请号：US16118096

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H01B1/20 ,  H05K1/00 ,  C09D11/00 ,  H05K1/09 ,  B22F9/24 ,  C09D11/52 ,  H01B1/22 ,  B22F1/00 ,  B22F1/02 ,  C09D11/037 ,  H05K3/02 ,  H05K3/12 ,  H05K3/22

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

公开(公告)号：US20180376592A1

公开(公告)日：2018-12-27

申请号：US16118096

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H05K1/09 ,  B22F1/00 ,  H05K3/22 ,  B22F1/02 ,  C09D11/037 ,  H05K3/02 ,  H01B1/20 ,  C09D11/52 ,  B22F9/24 ,  H01B1/22 ,  H05K3/12

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

公开(公告)号：US10091875B2

公开(公告)日：2018-10-02

申请号：US15301341

申请日：2015-04-01

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H01B1/22 ,  C09D11/00 ,  H05K1/09 ,  C09D11/52 ,  C09D11/037 ,  H05K3/12 ,  H05K3/22 ,  H05K3/02 ,  B22F1/02 ,  B22F1/00

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.