公开(公告)号：US10477681B2

公开(公告)日：2019-11-12

申请号：US16118212

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H01B1/20 ,  H05K1/00 ,  C09D5/24 ,  H05K1/09 ,  B22F9/24 ,  C09D11/52 ,  H01B1/22 ,  B22F1/00 ,  B22F1/02 ,  C09D11/037 ,  H05K3/02 ,  H05K3/12 ,  H05K3/22

Abstract: The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：US09977327B2

公开(公告)日：2018-05-22

申请号：US14760089

申请日：2014-03-12

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Kwonwoo Shin ,  Jisun Park ,  Jinwoo Cho ,  Yoonjin Kim

IPC: G03F7/038 ,  B82Y30/00 ,  C09D5/24 ,  G03F7/004

CPC classification number: G03F7/038 ,  B82Y30/00 ,  C09D5/24 ,  C09D7/61 ,  G03F7/0047

Abstract: The present invention relates to a photosensitive coating composition, a conductive coating film using the photosensitive coating composition, and a method for forming the conductive coating film. The present invention provides photosensitive coating composition for forming a conductive coating film, the composition containing a conductive nanomaterial and a photosensitive material. Further, the present invention provides a conductive coating film formed on a substrate, the conductive coating film formed using a photosensitive coating liquid. Here, after the photosensitive coating liquid is coated on the substrate, an exposed region and a non-exposed region are formed by exposure and washing, wherein the non-exposed region has at least two times the conductivity of the exposed region.

公开(公告)号：US20170118836A1

公开(公告)日：2017-04-27

申请号：US15301341

申请日：2015-04-01

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H05K1/09 ,  C09D11/037 ,  H01B1/22 ,  B22F1/00 ,  H05K3/22 ,  H05K3/02 ,  B22F1/02 ,  C09D11/52 ,  H05K3/12

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent

公开(公告)号：US20180376593A1

公开(公告)日：2018-12-27

申请号：US16118212

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  H05K3/12 ,  H05K3/02 ,  C09D11/037 ,  H01B1/20 ,  C09D11/52 ,  B22F9/24 ,  H01B1/22 ,  H05K3/22

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：US10555376B2

公开(公告)日：2020-02-04

申请号：US15351347

申请日：2016-11-14

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho

IPC: H05B3/14 ,  H01C17/075 ,  H05B3/46

Abstract: A heating paste composition, and a sheet heating element, a heating roller, a heating unit and a heating module, which use the composition, are disclosed. In one aspect, the heating paste composition includes 0.2 parts to 6 parts by weight of carbon nanotube particles, 0.5 parts to 30 parts by weight of graphite particles, 5 parts to 30 parts by weight of a binder mixture, 29 parts to 80 parts by weight of an organic solvent and 0.5 parts to 5 parts by weight of a dispersant, wherein the weights are with respect to 100 parts by weight of the heating paste composition.

公开(公告)号：US20180376592A1

公开(公告)日：2018-12-27

申请号：US16118096

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H05K1/09 ,  B22F1/00 ,  H05K3/22 ,  B22F1/02 ,  C09D11/037 ,  H05K3/02 ,  H01B1/20 ,  C09D11/52 ,  B22F9/24 ,  H01B1/22 ,  H05K3/12

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

公开(公告)号：US10091875B2

公开(公告)日：2018-10-02

申请号：US15301341

申请日：2015-04-01

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H01B1/22 ,  C09D11/00 ,  H05K1/09 ,  C09D11/52 ,  C09D11/037 ,  H05K3/12 ,  H05K3/22 ,  H05K3/02 ,  B22F1/02 ,  B22F1/00

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

公开(公告)号：US10536993B2

公开(公告)日：2020-01-14

申请号：US15233842

申请日：2016-08-10

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Jisun Park

IPC: H05B3/14 ,  H05B3/26 ,  H05B3/34 ,  H01C17/075

Abstract: The present disclosure relates to a heating paste composition which has heat stability, allows screen printing and gravure printing, has a small change in resistance depending on temperature, and can operate at low voltage and low power due to low specific resistance, to a surface type heating element using the same, and to a portable low-power heater. The heating paste composition may contain conductive particles including carbon nanotube particles and carbon nanoparticles, a mixture binder including epoxy acrylate or hexamethylene diisocyanate, a polyvinyl acetal and a phenol-based resin, an organic solvent, and a dispersant.

公开(公告)号：US10477680B2

公开(公告)日：2019-11-12

申请号：US16118096

申请日：2018-08-30

Applicant: Korea Electronics Technology Institute

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H01B1/20 ,  H05K1/00 ,  C09D11/00 ,  H05K1/09 ,  B22F9/24 ,  C09D11/52 ,  H01B1/22 ,  B22F1/00 ,  B22F1/02 ,  C09D11/037 ,  H05K3/02 ,  H05K3/12 ,  H05K3/22

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

公开(公告)号：US20160353524A1

公开(公告)日：2016-12-01

申请号：US15233842

申请日：2016-08-10

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Jisun Park

IPC: H05B3/14 ,  H01C17/075 ,  H05B3/26

Abstract: The present disclosure relates to a heating paste composition which has heat stability, allows screen printing and gravure printing, has a small change in resistance depending on temperature, and can operate at low voltage and low power due to low specific resistance, to a surface type heating element using the same, and to a portable low-power heater. The heating paste composition may contain conductive particles including carbon nanotube particles and carbon nanoparticles, a mixture binder including epoxy acrylate or hexamethylene diisocyanate, a polyvinyl acetal and a phenol-based resin, an organic solvent, and a dispersant.

Abstract translation: 本公开涉及一种具有热稳定性，允许丝网印刷和凹版印刷的加热浆料组合物，具有根据温度的电阻变化小，并且可以由于低电阻率而以低电压和低功率运行到表面型 使用其的加热元件，以及便携式低功率加热器。 加热糊组合物可以含有包含碳纳米管颗粒和碳纳米颗粒的导电颗粒，包含环氧丙烯酸酯或六亚甲基二异氰酸酯的混合物粘合剂，聚乙烯醇缩醛和酚基树脂，有机溶剂和分散剂。