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公开(公告)号：US11289788B2
公开(公告)日：2022-03-29
申请号：US16874213
申请日：2020-05-14
Inventor： Hyeon Min Bae , Ha Il Song , Huxian Jin
Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
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Patent Agency Ranking
2.发明授权Low power, high speed multi-channel chip-to-chip interface using dielectric waveguide 有权低功率，高速多通道芯片到芯片接口采用介质波导公开(公告)号：US09093732B2
公开(公告)日：2015-07-28
申请号：US14103005
申请日：2013-12-11
Inventor： Hyeon Min Bae , Ha Il Song , Huxian Jin
Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
Abstract translation: 本发明的示例性实施例提供了一种改进的电介质波导，称为电光纤。 具有金属覆层的电光纤可以隔离其它无线信道和相邻电缆中的信号的干扰，这通常导致带限问题，以减小辐射损耗，并且更好的信号导向以降低总的收发机功率消耗，因为传输 距离增加。 此外，电光纤可以具有频率独立的衰减特性，以便由于电光纤和互连设备的垂直耦合而很少或甚至没有任何额外的接收器侧补偿来实现高数据速率传输。
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公开(公告)号：US10777868B2
公开(公告)日：2020-09-15
申请号：US16145530
申请日：2018-09-28
Inventor： Hyeon Min Bae , Ha Il Song , Joon Yeong Lee , Tae Hoon Yoon , Hyo Sup Won
IPC: H01P3/16 , H01P3/10 , H01P5/08 , H01P3/12 , H01P5/02 , H01P3/08 , H01Q9/04 , H01Q13/06 , H04L12/40
Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part comprising two or more dielectrics having different permittivity; and a conductor part surrounding at least a part of the dielectric part.
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公开(公告)号：US10777865B2
公开(公告)日：2020-09-15
申请号：US16145576
申请日：2018-09-28
Inventor： Hyeon Min Bae , Ha Il Song , Joon Yeong Lee , Tae Hoon Yoon , Hyo Sup Won
IPC: H01P1/213 , H01P3/16 , H01P3/10 , H01P5/08 , H01P3/12 , H01P5/02 , H01P3/08 , H01Q9/04 , H01Q13/06 , H04L12/40
Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band is transmitted through the dielectric part, and a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part.
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公开(公告)号：US10770774B2
公开(公告)日：2020-09-08
申请号：US16145622
申请日：2018-09-28
Inventor： Hyeon Min Bae , Ha Il Song , Joon Yeong Lee , Tae Hoon Yoon , Hyo Sup Won
IPC: H01Q9/04 , H01P5/08 , H01P3/16 , H01P3/10 , H01P3/12 , H01P5/02 , H01P3/08 , H01Q13/06 , H04L12/40
Abstract: The present invention relates to a microstrip-waveguide transition for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a microstrip-waveguide transition for transmission of electromagnetic wave signals, comprising: a feeding part for providing an electromagnetic wave signal to be transmitted through the waveguide; and a ground part formed at a predetermined interval from the feeding part, wherein the microstrip and the waveguide are coupled alongside each other along a length direction of the waveguide, and wherein a distance between the feeding part and the ground part in a direction perpendicular to the length direction of the waveguide is greater as it is closer to the waveguide.
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公开(公告)号：US10686241B2
公开(公告)日：2020-06-16
申请号：US15555396
申请日：2015-06-02
Inventor： Hyeon Min Bae , Ha Il Song , Huxian Jin
Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
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