公开(公告)号：US20110277928A1

公开(公告)日：2011-11-17

申请号：US13192500

申请日：2011-07-28

申请人： Kiyoto ARAKI ,  Takashi IWAMOTO ,  Hajime KANDO

发明人： Kiyoto ARAKI ,  Takashi IWAMOTO ,  Hajime KANDO

IPC分类号： B32B37/14 ,  B32B38/10 ,  B32B37/02

CPC分类号： H01L21/76254 ,  H01L41/312 ,  H03H3/02 ,  H03H3/08

摘要： A method for manufacturing a composite substrate that prevents undesirable effects of etching a thin film includes a pattern forming step, an ion implanting step, a bonding step, and a separation step. In the pattern forming step, a pattern region and a reverse pattern region are formed on a principal surface of a functional material substrate. In the ion implanting step, by implanting ions into the functional material substrate, a separation layer is formed inside at a certain distance from the surface of each of the pattern region and the reverse pattern region. In the bonding step, the functional material substrate at the pattern region is bonded to a supporting substrate. In the separation step, the pattern region is separated from the functional material substrate, and the reverse pattern region is made to fall off.

摘要翻译： 制造防止薄膜蚀刻的不良影响的复合基板的制造方法包括图案形成工序，离子注入工序，粘合工序以及分离工序。 在图案形成步骤中，在功能材料基板的主表面上形成图案区域和反向图案区域。 在离子注入步骤中，通过将离子注入到功能材料基板中，在与图案区域和反向图案区域中的每一个的表面一定距离处形成分离层。 在接合工序中，图案区域的功能性材料基板与支撑基板接合。 在分离步骤中，图案区域与功能材料基板分离，反向图案区域脱落。

公开(公告)号：US20130193809A1

公开(公告)日：2013-08-01

申请号：US13568157

申请日：2012-08-07

申请人： Kiyoto ARAKI

发明人： Kiyoto ARAKI

IPC分类号： H01L41/332 ,  H01L41/047

CPC分类号： H01L41/29 ,  G01C19/5783 ,  H01L21/31144 ,  H01L41/0475 ,  H01L41/1138 ,  H01L41/312 ,  H01L41/332 ,  H03H3/02 ,  H03H9/02047 ,  H03H9/173 ,  H03H2003/021 ,  Y10T29/42

摘要： A piezoelectric device prevents damage to a piezoelectric thin film caused by etching and the manufacturing cost of the piezoelectric device is reduced. On a surface of a support layer formed on a support substrate, an etching adjustment layer is formed. An etchant flows through etching windows to simultaneously form a through hole through which a portion of a sacrificial layer is exposed to a side of a piezoelectric thin film and an opening through which the etching adjustment layer, which is conductive with a lower electrode, is exposed to the side of the piezoelectric thin film. By making an etchant flow through the through hole, the sacrificial layer is removed. A lead-out wiring is formed between an upper electrode and a bump pad and a lead-out wiring is formed between the conductive etching adjustment layer, which is conductive with the lower electrode, and a bump pad.

摘要翻译： 压电装置防止由蚀刻引起的压电薄膜的损坏，并且压电装置的制造成本降低。 在形成在支撑基板上的支撑层的表面上形成蚀刻调整层。 蚀刻剂流过蚀刻窗口以同时形成通孔，牺牲层的一部分暴露于压电薄膜的侧面，并且通过该开口暴露下部电极导电的蚀刻调节层暴露 到压电薄膜的一侧。 通过使蚀刻剂流过通孔，去除牺牲层。 在上电极和凸块焊盘之间形成引出布线，并且在与下电极导电的导电蚀刻调整层与凸块焊盘之间形成引出布线。