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    ELECTRONIC APPARATUS AND FLEXIBLE PRINTED WIRING BOARD
    1.
    发明申请
    ELECTRONIC APPARATUS AND FLEXIBLE PRINTED WIRING BOARD 有权
    电子设备和柔性印刷接线板

    公开(公告)号：US20100226103A1

    公开(公告)日：2010-09-09

    申请号：US12615064

    申请日：2009-11-09

    申请人： Kiyomi MURO ,  Sadahiro TAMAI

    发明人： Kiyomi MURO ,  Sadahiro TAMAI

    IPC分类号： H05K1/00

    CPC分类号： H05K1/118 ,  G06F1/1616 ,  G06F1/1658 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/097 ,  Y10T29/53157 ,  Y10T29/53261

    摘要： According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

    摘要翻译： 根据一个实施例，一种电子设备包括壳体，容纳在所述软管中的电路板，并且包括位于与所述第一表面相对的一侧的第一表面和第二表面，具有弹性的柔性印刷线路板，电连接到 所述电路板从所述电路板的所述第一表面提供到所述第二表面;以及按压部，所述按压部在弯曲时由柔性印刷布线板的一部分形成，并且将柔性印刷布线板朝向第一表面按压 使其与壳体的与电路板的第一表面相对的内表面接触。

    FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS
    2.
    发明申请
    FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS 审中-公开
    柔性印刷电路板和电子设备

    公开(公告)号：US20090244859A1

    公开(公告)日：2009-10-01

    申请号：US12345069

    申请日：2008-12-29

    申请人： Kiyomi MURO ,  Sadahiro Tamai

    发明人： Kiyomi MURO ,  Sadahiro Tamai

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0218 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618

    摘要： According to one embodiment, a plurality of bumps are formed by repeatedly applying conductive paste to the conductive pattern portion, a plurality of bump-guiding openings are provided in the cover layer to align with the plurality of bumps, a plurality of crushed portions are formed by crushing heads of the plurality of bumps protruding from the cover layer through the bump-guiding openings, and a ground layer is formed on the cover layer. The ground layer is electrically connected to the plurality of crushed portions.

    摘要翻译： 根据一个实施例，通过将导电膏重复地施加到导电图案部分而形成多个凸起，在覆盖层中设置多个凸起引导开口以与多个凸起对准，形成多个压碎部 通过从覆盖层突出的多个凸块的头部通过凸块引导孔破碎，并且在覆盖层上形成接地层。 接地层与多个压碎部电连接。

    PRINTED WIRING BOARD AND ELECTRONIC APPARATUS
    3.
    发明申请
    PRINTED WIRING BOARD AND ELECTRONIC APPARATUS 有权
    印刷线路板和电子设备

    公开(公告)号：US20100132981A1

    公开(公告)日：2010-06-03

    申请号：US12580124

    申请日：2009-10-15

    申请人： Kiyomi MURO ,  Gen FUKAYA

    发明人： Kiyomi MURO ,  Gen FUKAYA

    IPC分类号： H05K1/02 ,  H05K7/00

    CPC分类号： H05K1/0236 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09336 ,  H05K2201/09681 ,  H05K2201/0969

    摘要： According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.

    摘要翻译： 根据一个实施例，印刷布线板包括绝缘层，绝缘层上的构成为信号线的第一导体图案和绝缘层上的第二导体图案。 第二导体图案包括比第一导体图案更大的导体面积，以及允许第二导体图案拉伸以跟随绝缘层的热膨胀的狭缝。

    FLEXIBLE PRINTED CIRCUIT BOARD, SHIELD PROCESSING METHOD FOR THE CIRCUIT BOARD AND ELECTRONIC APPARATUS
    5.
    发明申请
    FLEXIBLE PRINTED CIRCUIT BOARD, SHIELD PROCESSING METHOD FOR THE CIRCUIT BOARD AND ELECTRONIC APPARATUS 审中-公开
    柔性印刷电路板，电路板和电子设备的屏蔽处理方法

    公开(公告)号：US20090294155A1

    公开(公告)日：2009-12-03

    申请号：US12475324

    申请日：2009-05-29

    申请人： Daigo SUZUKI ,  Kiyomi MURO ,  Terunari KANO ,  Gen FUKAYA

    发明人： Daigo SUZUKI ,  Kiyomi MURO ,  Terunari KANO ,  Gen FUKAYA

    IPC分类号： H05K1/00 ,  H05K3/10

    CPC分类号： H05K1/0218 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/0959 ,  H05K2201/0969 ,  Y10T29/49155

    摘要： According to one embodiment, there is provided a flexible printed circuit board including a base layer, a signal layer formed on a surface of the base layer, a cover layer covering the signal layer, a connecting pattern portion formed in the signal layer, an opening formed in the cover layer and surrounds periphery of the connecting pattern portion, a conductive shield material covering the cover layer in which part of the conductive shield material fills the opening, thereby adhering to an upper face and sides of the connecting pattern portion, and a protective layer covering the conductive shield material.

    摘要翻译： 根据一个实施例，提供了一种柔性印刷电路板，其包括基底层，形成在基底层的表面上的信号层，覆盖信号层的覆盖层，形成在信号层中的连接图案部分，开口 形成在覆盖层中并且围绕连接图案部分的周围，覆盖覆盖层的导电屏蔽材料，其中导电屏蔽材料的一部分填充开口，从而粘附到连接图案部分的上表面和侧面， 覆盖导电屏蔽材料的保护层。