摘要:
According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.
摘要:
According to one embodiment, a plurality of bumps are formed by repeatedly applying conductive paste to the conductive pattern portion, a plurality of bump-guiding openings are provided in the cover layer to align with the plurality of bumps, a plurality of crushed portions are formed by crushing heads of the plurality of bumps protruding from the cover layer through the bump-guiding openings, and a ground layer is formed on the cover layer. The ground layer is electrically connected to the plurality of crushed portions.
摘要:
According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.
摘要:
According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions are formed by filling conductive paste in the plurality of conductive-paste-filling openings to conductively join the metal layer to the conductive pattern portion.
摘要:
According to one embodiment, there is provided a flexible printed circuit board including a base layer, a signal layer formed on a surface of the base layer, a cover layer covering the signal layer, a connecting pattern portion formed in the signal layer, an opening formed in the cover layer and surrounds periphery of the connecting pattern portion, a conductive shield material covering the cover layer in which part of the conductive shield material fills the opening, thereby adhering to an upper face and sides of the connecting pattern portion, and a protective layer covering the conductive shield material.
摘要:
According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions are formed by filling conductive paste in the plurality of conductive-paste-filling openings to conductively join the metal layer to the conductive pattern portion.