Physical Vapour Deposition Processes
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    发明申请
    Physical Vapour Deposition Processes 审中-公开
    物理气相沉积工艺

    公开(公告)号:US20110263073A1

    公开(公告)日:2011-10-27

    申请号:US12994849

    申请日:2009-05-25

    CPC分类号: C23C14/0629 C23C14/22

    摘要: A method of depositing a film of a first material, such as Cadmium Telluride on to a second material, such as Cadmium Sulphide by a physical vapour deposition process wherein said deposition is performed in an atmosphere having a relatively high ambient pressure, in one embodiment between 50 and 200 Torr.

    摘要翻译: 通过物理气相沉积工艺将诸如碲化镉的第一材料的膜沉积到第二材料例如硫化镉的方法,其中所述沉积在具有较高环境压力的气氛中进行,在一个实施方案中在 50和200乇。