公开(公告)号：US09214402B2

公开(公告)日：2015-12-15

申请号：US14151811

申请日：2014-01-10

申请人： Kee Cheong Fam ,  Mohd Rusli Ibrahim ,  Lan Chu Tan

发明人： Kee Cheong Fam ,  Mohd Rusli Ibrahim ,  Lan Chu Tan

IPC分类号： H01L23/24 ,  H01L23/00 ,  H01L21/56 ,  H01L29/84 ,  H01L23/31

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/29 ,  H01L24/45 ,  H01L29/84 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/92247 ,  H01L2924/11 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

摘要： A pressure sensor device includes a gel retainer that is mounted or formed on a substrate. The gel retainer has a cavity and a pressure sensing die is mounted inside the cavity. The die is electrically connected to one or more other package elements. A pressure-sensitive gel material is dispensed into the cavity to cover an active region of the pressure sensing die. A mold compound is applied on an upper surface of the substrate outside of the gel retainer.

摘要翻译： 压力传感器装置包括安装或形成在基底上的凝胶保持器。 凝胶保持器具有空腔，并且压力感测模具安装在腔体内。 模具电连接到一个或多个其它封装元件。 将压敏凝胶材料分配到空腔中以覆盖压力感测模具的有源区域。 将模具化合物施加在凝胶保持器外部的基板的上表面上。

公开(公告)号：US20150200180A1

公开(公告)日：2015-07-16

申请号：US14151811

申请日：2014-01-10

申请人： Kee Cheong Fam ,  Mohd Rusli Ibrahim ,  Lan Chu Tan

发明人： Kee Cheong Fam ,  Mohd Rusli Ibrahim ,  Lan Chu Tan

IPC分类号： H01L23/00 ,  H01L29/84 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/29 ,  H01L24/45 ,  H01L29/84 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/92247 ,  H01L2924/11 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

摘要： A pressure sensor device includes a gel retainer that is mounted or formed on a substrate. The gel retainer has a cavity and a pressure sensing die is mounted inside the cavity. The die is electrically connected to one or more other package elements. A pressure-sensitive gel material is dispensed into the cavity to cover an active region of the pressure sensing die. A mold compound is applied on an upper surface of the substrate outside of the gel retainer.

摘要翻译： 压力传感器装置包括安装或形成在基底上的凝胶保持器。 凝胶保持器具有空腔，并且压力感测模具安装在腔体内。 模具电连接到一个或多个其它封装元件。 将压敏凝胶材料分配到空腔中以覆盖压力感测模具的有源区域。 将模具化合物施加在凝胶保持器外部的基板的上表面上。