Housing for Flow-Conducting Components
    8.
    发明公开

    公开(公告)号:US20230265861A1

    公开(公告)日:2023-08-24

    申请号:US18017815

    申请日:2021-07-26

    申请人: KSB SE & Co. KGaA

    发明人: Tammuz NOBEL

    IPC分类号: F04D29/42 B33Y80/00

    摘要: A method for forming a housing for a flow-conducting component includes forming at least two functional regions of the housing having different material properties using at least one of radiation-induced melting and solidification of a build material and a process gas jet. Each functional region of the housing may be generated from a different construction material, and at least one functional layer may be formed with a reduced weight structure such as a honeycomb structure.