Abstract:
A sticker-type electronic device which is freely detachably attachable to various bodies repeatedly is provided. The electronic device includes a main substrate which exhibits a surface adhesion property due to the properties of a material thereof and which provides an attachment/detachment surface to an article, and an electrode formed by being transferred from a temporary substrate to a surface that is opposite to the attachment/detachment surface of the main substrate to the article wherein the electrode is transferred directly to the main substrate using the adhesion property of the main substrate. The electronic device is freely detachably attachable to the surface of the article repeatedly using the surface adhesion property of the main substrate. The electronic device is formed directly on the surface of the substrate constituted by the material having the surface adhesion property, thereby providing a sticker-type electronic device which is freely repeatedly detachably attachable to various bodies.
Abstract:
Disclosed are a method of manufacturing a flexible thin-film type super-capacitor device and a super-capacitor device manufactured by the same. The flexible thin-film type super-capacitor device comprises a base film which has flexibility; a separator which is interposed between the base films; and an active material which is formed on the base film. Thus, flexibility is given since thickness is very thin while maintaining high electrical conductivity and high binding property. In addition, economic feasibility is high and mass production is possible. Further, it is possible to stably and efficiently contain a highly corrosive material.
Abstract:
Disclosed are a method of manufacturing a flexible thin-film type super-capacitor device and a super-capacitor device manufactured by the same. The flexible thin-film type super-capacitor device comprises a base film which has flexibility; a separator which is interposed between the base films; and an active material which is formed on the base film. Thus, flexibility is given since thickness is very thin while maintaining high electrical conductivity and high binding property. In addition, economic feasibility is high and mass production is possible. Further, it is possible to stably and efficiently contain a highly corrosive material.