公开(公告)号：US10418227B2

公开(公告)日：2019-09-17

申请号：US15719128

申请日：2017-09-28

Applicant: KOREA BASIC SCIENCE INSTITUTE

Inventor： Dong Chan Seok ,  Yong Ho Jung ,  Hyun Young Jeong

IPC: B01J19/08 ,  H01J37/32 ,  H05H1/24

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.

公开(公告)号：US10056234B2

公开(公告)日：2018-08-21

申请号：US15827929

申请日：2017-11-30

Applicant: KOREA BASIC SCIENCE INSTITUTE

Inventor： Dong Chan Seok ,  Yong Ho Jung ,  Hyun Young Jeong

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  H01J37/32 ,  H05H1/48 ,  B01J19/08 ,  H05H1/24

CPC classification number: H01J37/32568 ,  B01J19/088 ,  B01J2219/0835 ,  B01J2219/0879 ,  H01J37/32348 ,  H05H1/48 ,  H05H2001/2412

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

公开(公告)号：US20150187543A1

公开(公告)日：2015-07-02

申请号：US14409357

申请日：2013-12-06

Applicant: KOREA BASIC SCIENCE INSTITUTE

Inventor： Dong Chan Seok ,  Yong Ho Jung ,  Hyun Young Jeong

IPC: H01J37/32

CPC classification number: H01J37/32568 ,  B01J19/088 ,  B01J2219/0835 ,  B01J2219/0879 ,  H01J37/32348 ,  H05H1/48 ,  H05H2001/2412

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

Abstract translation: 公开了一种粉末等离子体处理装置。 粉末等离子体处理装置包括：室，被配置为对粉末进行等离子体处理; 设置在所述室的上部的粉末供给单元; 以及多个板状表面放电等离子体模块，其设置在所述粉末供给单元的下方并且位于所述室内，其中所述表面放电等离子体模块的表面彼此间隔开。 根据粉末等离子体处理装置，可以均匀地加工粉末，并且可以控制粉末与等离子体接触的时间，从而实现有效的粉末处理。