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公开(公告)号:US11647338B2
公开(公告)日:2023-05-09
申请号:US17347415
申请日:2021-06-14
Inventor: Keonjae Lee , Young Hoon Jung , Jae Hyun Han , Hee Seung Wang , Mingi Chung
IPC: H04R17/02 , H10N30/88 , H10N30/20 , H10N30/853 , H10N30/078 , H04R3/04 , H04R1/04 , H04R17/00 , H04R7/04 , H03F3/183 , H01L41/053 , H01L41/09 , H01L41/187 , H01L41/318
CPC classification number: H04R17/02 , H01L41/0533 , H01L41/0973 , H01L41/1876 , H01L41/318 , H03F3/183 , H04R1/04 , H04R3/04 , H04R7/04 , H04R17/005 , H03F2200/03 , H04R2307/025 , H04R2440/01
Abstract: Provided is a voice sensor comprising a piezoelectric material layer includes a substrate, a support layer, a metal layer, a piezoelectric material layer on the metal layer and an electrode on the piezoelectric material layer, and the substrate integrally supports a device layer of the voice sensor by exposing a part of a thin film including the piezoelectric material layer, the electrode and a polymer layer.
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公开(公告)号:US20210409871A1
公开(公告)日:2021-12-30
申请号:US17347415
申请日:2021-06-14
Inventor: Keonjae Lee , Young Hoon Jung , Jae Hyun Han , Hee Seung Wang , Mingi Chung
IPC: H04R17/02 , H01L41/053 , H01L41/09 , H01L41/187 , H01L41/318 , H03F3/183 , H04R3/04 , H04R1/04 , H04R17/00 , H04R7/04
Abstract: Provided is a voice sensor comprising a piezoelectric material layer includes a substrate, a support layer, a metal layer, a piezoelectric material layer on the metal layer and an electrode on the piezoelectric material layer, and the substrate integrally supports a device layer of the voice sensor by exposing a part of a thin film including the piezoelectric material layer, the electrode and a polymer layer.
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