公开(公告)号：US11462343B2

公开(公告)日：2022-10-04

申请号：US16771393

申请日：2018-12-11

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C1/14 ,  H01C1/02 ,  H01C17/02

Abstract: An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.

公开(公告)号：US10892074B2

公开(公告)日：2021-01-12

申请号：US16771334

申请日：2018-12-11

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.

公开(公告)号：US20200312490A1

公开(公告)日：2020-10-01

申请号：US16903674

申请日：2020-06-17

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.

公开(公告)号：US11011290B2

公开(公告)日：2021-05-18

申请号：US16903674

申请日：2020-06-17

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.

公开(公告)号：US20200343028A1

公开(公告)日：2020-10-29

申请号：US16771334

申请日：2018-12-11

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.