公开(公告)号：US11462343B2

公开(公告)日：2022-10-04

申请号：US16771393

申请日：2018-12-11

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C1/14 ,  H01C1/02 ,  H01C17/02

Abstract: An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.

公开(公告)号：US20180120359A1

公开(公告)日：2018-05-03

申请号：US15568910

申请日：2016-04-21

Applicant: KOA CORPORATION

Inventor： Keishi Nakamura ,  Koichi Minowa

IPC: G01R19/00 ,  H01C1/14 ,  H01R4/34

CPC classification number: G01R19/0092 ,  G01R1/203 ,  H01C1/14 ,  H01C13/00 ,  H01R4/34

Abstract: Provided is a current detection device that enables to eliminate the influence of vibration that is applied to a bus bar, which is configured as a shunt resistor and measures current with high accuracy and high reliability. The current detection device is provided with a first wiring member and a second wiring member consisting of a conductive metal material, and a resistor body consisting of a metal material having a lower temperature coefficient of resistance than those wiring members and is joined between the first wiring member and the second wiring member, wherein a connection portion for making a connection to another wiring member or device is formed at an end of the first wiring member and second wiring member, the end being an opposite side from a joint with the resistor body, and a fixing member is provided between the connection portion and the joint with the resistor body.

公开(公告)号：US11011290B2

公开(公告)日：2021-05-18

申请号：US16903674

申请日：2020-06-17

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.

公开(公告)号：US20200343028A1

公开(公告)日：2020-10-29

申请号：US16771334

申请日：2018-12-11

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.

公开(公告)号：US10892074B2

公开(公告)日：2021-01-12

申请号：US16771334

申请日：2018-12-11

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.

公开(公告)号：US20200312490A1

公开(公告)日：2020-10-01

申请号：US16903674

申请日：2020-06-17

Applicant: KOA CORPORATION

Inventor： Yuichi Abe ,  Seiji Karasawa ,  Michio Kubota ,  Yoji Gomi ,  Koichi Minowa

IPC: H01C17/28

Abstract: The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.

公开(公告)号：US20180100877A1

公开(公告)日：2018-04-12

申请号：US15568882

申请日：2016-04-21

Applicant: KOA CORPORATION

Inventor： Keishi Nakamura ,  Hitoshi Amemiya ,  Koichi Minowa

IPC: G01R1/20 ,  G01R31/36 ,  H01M10/42 ,  H01M10/48 ,  H01R11/28 ,  G01R19/165

CPC classification number: G01R1/203 ,  G01R19/16542 ,  G01R31/364 ,  H01C1/01 ,  H01C1/14 ,  H01C7/00 ,  H01M10/425 ,  H01M10/48 ,  H01R11/287

Abstract: A current detection device formed as a shunt resistor is configured such that, when using the device for connecting to a bus bar, which configures a current path, by rotational fixing with fixing members, rotational force is not applied to joint interface between a resistor body and wiring members of the shunt resistor. The device includes a first wiring member and a second wiring member those consisting of a conductive metal material, and a resistor body consisting of a metal material having a lower temperature coefficient of resistance than those wiring members and is joined onto the first wiring member and the second wiring member, wherein the first wiring member is provided with a through hole, into which a fixing member for rotational fixing is inserted, and a positioning portion, which serves to prevent rotation of the first wiring member caused by rotational fixing with fixing members.