公开(公告)号：US11742116B2

公开(公告)日：2023-08-29

申请号：US17741568

申请日：2022-05-11

Applicant: KOA CORPORATION

Inventor： Kazuhisa Ushiyama ,  Yuta Watanabe

IPC: H01C7/22

CPC classification number: H01C7/22

Abstract: The resistor 5 is a print-formed body including a meandering shaped first region 8 connected to the first front electrode 3 and a second region 9 connected to the first region 8 via a linking portion 10 and connected to the second front electrode 4. The first region 8 is provided with an I-cut shaped first trimming groove 11 and the second region 9 is provided with an L-cut shaped second trimming groove 12, and the side of the second region 9 positioned in the direction toward which a turn portion 12b of the second trimming groove 12 extends is an oblique side 9a that inclines to approach the second front electrode 4 as it approaches the connecting portion 7.

公开(公告)号：US11164688B2

公开(公告)日：2021-11-02

申请号：US16980539

申请日：2019-03-19

Applicant: KOA CORPORATION

Inventor： Natsuki Iguchi ,  Kazuhisa Ushiyama ,  Yasuhiro Kamijo

IPC: H01C1/084 ,  H01C1/146 ,  H01C17/00 ,  H01C17/242

Abstract: An object is to provide a chip resistor in which hot spots can be dispersed and the adverse effects on performance caused by microcracks can also be reduced. A chip resistor includes an insulating substrate, a resistive element, and electrodes. In the resistive element, a first trimming groove and a second trimming groove are formed. A first vertical groove of the first trimming groove and a second vertical groove of the second trimming groove are formed with a spacing in between in an X1-X2 direction. A first horizontal groove of the first trimming groove and a second horizontal groove of the second trimming groove extend in directions approaching each other, and terminal ends of the first horizontal groove and the second horizontal groove are formed to be separated in the X1-X2 direction such that the first horizontal groove and the second horizontal groove do not overlap in a Y1-Y2 direction.

公开(公告)号：US11626219B2

公开(公告)日：2023-04-11

申请号：US17584788

申请日：2022-01-26

Applicant: KOA CORPORATION

Inventor： Kazuhisa Ushiyama

IPC: H01C1/14 ,  H01C17/00 ,  H01C7/00

Abstract: A glass protective film 4 is formed such that boundaries of top surface electrodes 3a and 3b do not exist at the base of corner portions of the rectangular glass protective film 4 so as to eliminate level differences generating due to thicknesses of the electrodes. Use of such a structure may resolve the problem that when printing glass paste individually over chip elements of a chip resistor on a large substrate from which multiple chips will be obtained, corner portions of the glass protective film bleed (flow) to the outer side (dividing grooves).

公开(公告)号：US11170918B2

公开(公告)日：2021-11-09

申请号：US17049486

申请日：2019-04-08

Applicant: KOA CORPORATION

Inventor： Kazuhisa Ushiyama ,  Natsuki Iguchi ,  Yasuhiro Kamijo ,  Hisakazu Nagata

IPC: H01C17/00 ,  H01C17/242

Abstract: A chip resistor is capable of improving surge characteristic while finely adjusting a resistance value with high accuracy. A chip resistor includes a resistor which is print-formed such that a first meandering portion is consecutively connected to a second meandering portion across a rectangular adjustment portion. The adjustment portion is provided with a first trimming groove to lengthen a current path of the resistor, thereby improving the surge characteristic while coarsely adjusting a resistance value of the resistor to bring it close to a target resistance value. Furthermore, a second trimming groove is provided in an area of the second meandering portion where a current distribution is small, thereby finely adjusting the resistance value of the resistor to make it coincide with the target resistance value in accordance with a cutting amount of the second trimming groove.