公开(公告)号：US10438825B2

公开(公告)日：2019-10-08

申请号：US15688751

申请日：2017-08-28

申请人： KLA-Tencor Corporation

发明人： Prateek Jain ,  Daniel Wack ,  Kevin A. Peterlinz ,  Andrei V. Shchegrov ,  Shankar Krishnan

IPC分类号： H01L21/67 ,  H01L21/66

摘要： Methods and systems for performing in-situ, selective spectral reflectometry (SSR) measurements of semiconductor structures disposed on a wafer are presented herein. Illumination light reflected from a wafer surface is spatially imaged. Signals from selected regions of the image are collected and spectrally analyzed, while other portions of the image are discarded. In some embodiments, a SSR includes a dynamic mirror array (DMA) disposed in the optical path at or near a field plane conjugate to the surface of the semiconductor wafer under measurement. The DMA selectively blocks the undesired portion of wafer image. In other embodiments, a SSR includes a hyperspectral imaging system including a plurality of spectrometers each configured to collect light from a spatially distinct area of a field image conjugate to the wafer surface. Selected spectral signals associated with desired regions of the wafer image are selected for analysis.

公开(公告)号：US20180061691A1

公开(公告)日：2018-03-01

申请号：US15688751

申请日：2017-08-28

申请人： KLA-Tencor Corporation

发明人： Prateek Jain ,  Daniel Wack ,  Kevin A. Peterlinz ,  Andrei V. Shchegrov ,  Shankar Krishnan

IPC分类号： H01L21/67 ,  H01L21/66

CPC分类号： H01L21/67253 ,  H01L22/10 ,  H01L22/12

摘要： Methods and systems for performing in-situ, selective spectral reflectometry (SSR) measurements of semiconductor structures disposed on a wafer are presented herein. Illumination light reflected from a wafer surface is spatially imaged. Signals from selected regions of the image are collected and spectrally analyzed, while other portions of the image are discarded. In some embodiments, a SSR includes a dynamic mirror array (DMA) disposed in the optical path at or near a field plane conjugate to the surface of the semiconductor wafer under measurement. The DMA selectively blocks the undesired portion of wafer image. In other embodiments, a SSR includes a hyperspectral imaging system including a plurality of spectrometers each configured to collect light from a spatially distinct area of a field image conjugate to the wafer surface. Selected spectral signals associated with desired regions of the wafer image are selected for analysis.