公开(公告)号：US09947596B2

公开(公告)日：2018-04-17

申请号：US15227698

申请日：2016-08-03

Applicant: KLA-Tencor Corporation

Inventor： Hemanta Kumar Roy ,  Arpit Jain ,  Arpit Yati ,  Olivier Moreau ,  Arun Lobo

IPC: H01J37/22 ,  H01J37/28 ,  H01J37/20 ,  H01L21/66

CPC classification number: H01L22/00 ,  H01J2237/24571 ,  H01J2237/24592 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: A technique to identify non-visual defects, such as SEM non-visual defects (SNVs), includes generating an image of a layer of a wafer, evaluating at least one attribute of the image using a classifier, and identifying the non-visual defects on the layer of the wafer. A controller can be configured to identify the non-visual defects using the classifier. This controller can communicate with a defect review tool, such as a scanning electron microscope (SEM).

公开(公告)号：US20170040142A1

公开(公告)日：2017-02-09

申请号：US15227698

申请日：2016-08-03

Applicant: KLA-Tencor Corporation

Inventor： Hemanta Kumar Roy ,  Arpit Jain ,  Arpit Yati ,  Olivier Moreau ,  Arun Lobo

IPC: H01J37/22 ,  H01J37/28 ,  H01J37/20

CPC classification number: H01L22/00 ,  H01J2237/24571 ,  H01J2237/24592 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: A technique to identify non-visual defects, such as SEM non-visual defects (SNVs), includes generating an image of a layer of a wafer, evaluating at least one attribute of the image using a classifier, and identifying the non-visual defects on the layer of the wafer. A controller can be configured to identify the non-visual defects using the classifier. This controller can communicate with a defect review tool, such as a scanning electron microscope (SEM).

Abstract translation: 识别非视觉缺陷的技术，例如SEM非视觉缺陷（SNV），包括生成晶片层的图像，使用分类器评估图像的至少一个属性，以及识别非视觉缺陷 在晶片层上。 可以将控制器配置为使用分类器识别非视觉缺陷。 该控制器可以与诸如扫描电子显微镜（SEM）的缺陷检查工具进行通信。

公开(公告)号：US20170228866A1

公开(公告)日：2017-08-10

申请号：US15258546

申请日：2016-09-07

Applicant: KLA-Tencor Corporation

Inventor： Arpit Jain ,  Arpit Yati ,  Thirupurasundari Jayaraman ,  Raghavan Konuru ,  Raj Kuppa ,  Hema Prasad ,  Saiyashwanth Momula ,  Arun Lobo

IPC: G06T7/00 ,  G01N23/225 ,  H01L21/66 ,  H01J37/22

CPC classification number: H01L22/20 ,  G01N23/2251 ,  G01N2223/6116 ,  G06T3/608 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12

Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.

公开(公告)号：US10204416B2

公开(公告)日：2019-02-12

申请号：US15258546

申请日：2016-09-07

Applicant: KLA-Tencor Corporation

Inventor： Arpit Jain ,  Arpit Yati ,  Thirupurasundari Jayaraman ,  Raghavan Konuru ,  Raj Kuppa ,  Hema Prasad ,  Saiyashwanth Momula ,  Arun Lobo

IPC: H04N7/18 ,  G06T7/00 ,  H01J37/22 ,  G01N23/2251 ,  H01L21/66

Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.