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公开(公告)号:US20170228866A1
公开(公告)日:2017-08-10
申请号:US15258546
申请日:2016-09-07
Applicant: KLA-Tencor Corporation
Inventor: Arpit Jain , Arpit Yati , Thirupurasundari Jayaraman , Raghavan Konuru , Raj Kuppa , Hema Prasad , Saiyashwanth Momula , Arun Lobo
IPC: G06T7/00 , G01N23/225 , H01L21/66 , H01J37/22
CPC classification number: H01L22/20 , G01N23/2251 , G01N2223/6116 , G06T3/608 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , H01L22/12
Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
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公开(公告)号:US10204416B2
公开(公告)日:2019-02-12
申请号:US15258546
申请日:2016-09-07
Applicant: KLA-Tencor Corporation
Inventor: Arpit Jain , Arpit Yati , Thirupurasundari Jayaraman , Raghavan Konuru , Raj Kuppa , Hema Prasad , Saiyashwanth Momula , Arun Lobo
IPC: H04N7/18 , G06T7/00 , H01J37/22 , G01N23/2251 , H01L21/66
Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
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