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1.
公开(公告)号:US20200161081A1
公开(公告)日:2020-05-21
申请号:US16249337
申请日:2019-01-16
Applicant: KLA-TENCOR CORPORATION
Inventor: Hari Pathangi , Sivaprrasath Meenakshisundaram , Tanay Bansal
Abstract: A heat map of probable defects in an image can be represented as a matrix of defect probability index corresponding to each pixel. The image may be generated from data received from a detector of a scanning electron microscope or other inspection tools. A number of pixels in the image that exceed a corresponding threshold in the matrix can be quantified.
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公开(公告)号:US11035666B2
公开(公告)日:2021-06-15
申请号:US15904402
申请日:2018-02-25
Applicant: KLA-TENCOR CORPORATION
Inventor: Jagdish Chandra Saraswatula , Arpit Yati , Hari Pathangi
Abstract: Systems and methods for determining location of critical dimension (CD) measurement or inspection are disclosed. Real-time selection of locations to take critical dimension measurements based on potential impact of critical dimension variations at the locations can be performed. The design of a semiconductor device also can be used to predict locations that may be impacted by critical dimension variations. Based on an ordered location list, which can include ranking or criticality, critical dimension can be measured at selected locations. Results can be used to refine a critical dimension location prediction model.
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公开(公告)号:US10672588B1
公开(公告)日:2020-06-02
申请号:US16249337
申请日:2019-01-16
Applicant: KLA-TENCOR CORPORATION
Inventor: Hari Pathangi , Sivaprrasath Meenakshisundaram , Tanay Bansal
Abstract: A heat map of probable defects in an image can be represented as a matrix of defect probability index corresponding to each pixel. The image may be generated from data received from a detector of a scanning electron microscope or other inspection tools. A number of pixels in the image that exceed a corresponding threshold in the matrix can be quantified.
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公开(公告)号:US10473460B2
公开(公告)日:2019-11-12
申请号:US15979336
申请日:2018-05-14
Applicant: KLA-Tencor Corporation
Inventor: Nadav Gutman , Eran Amit , Stefan Eyring , Hari Pathangi , Frank Laske , Ulrich Pohlmann , Thomas Heidrich
Abstract: An overlay metrology system includes a particle-beam metrology tool to scan a particle beam across an overlay target on a sample including a first-layer target element and a second-layer target element. The overlay metrology system may further include a controller to receive a scan signal from the particle-beam metrology tool, determine symmetry measurements for the scan signal with respect to symmetry metrics, and generate an overlay measurement between the first layer and the second layer based on the symmetry measurements in which an asymmetry of the scan signal is indicative of a misalignment of the second-layer target element with respect to the first-layer target element and a value of the overlay measurement is based on the symmetry measurements.
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5.
公开(公告)号:US20190178639A1
公开(公告)日:2019-06-13
申请号:US15979336
申请日:2018-05-14
Applicant: KLA-Tencor Corporation
Inventor: Nadav Gutman , Eran Amit , Stefan Eyring , Hari Pathangi , Frank Laske , Ulrich Pohlmann , Thomas Heidrich
IPC: G01B15/00
Abstract: An overlay metrology system includes a particle-beam metrology tool to scan a particle beam across an overlay target on a sample including a first-layer target element and a second-layer target element. The overlay metrology system may further include a controller to receive a scan signal from the particle-beam metrology tool, determine symmetry measurements for the scan signal with respect to symmetry metrics, and generate an overlay measurement between the first layer and the second layer based on the symmetry measurements in which an asymmetry of the scan signal is indicative of a misalignment of the second-layer target element with respect to the first-layer target element and a value of the overlay measurement is based on the symmetry measurements.
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