Patent search ap:("KLA-Tencor Corporation") AND inv:"Thomas Heidrich" Page 1

1.

发明授权
Overlay measurements of overlapping target structures based on symmetry of scanning electron beam signals 有权

公开(公告)号：US10473460B2

公开(公告)日：2019-11-12

申请号：US15979336

申请日：2018-05-14

Applicant: KLA-Tencor Corporation

Inventor： Nadav Gutman , Eran Amit , Stefan Eyring , Hari Pathangi , Frank Laske , Ulrich Pohlmann , Thomas Heidrich

IPC: H01J37/26 , G01B15/00

Abstract: An overlay metrology system includes a particle-beam metrology tool to scan a particle beam across an overlay target on a sample including a first-layer target element and a second-layer target element. The overlay metrology system may further include a controller to receive a scan signal from the particle-beam metrology tool, determine symmetry measurements for the scan signal with respect to symmetry metrics, and generate an overlay measurement between the first layer and the second layer based on the symmetry measurements in which an asymmetry of the scan signal is indicative of a misalignment of the second-layer target element with respect to the first-layer target element and a value of the overlay measurement is based on the symmetry measurements.

2.

发明申请
Overlay Measurements of Overlapping Target Structures Based on Symmetry of Scanning Electron Beam Signals 审中-公开

公开(公告)号：US20190178639A1

公开(公告)日：2019-06-13

申请号：US15979336

申请日：2018-05-14

Applicant: KLA-Tencor Corporation

Inventor： Nadav Gutman , Eran Amit , Stefan Eyring , Hari Pathangi , Frank Laske , Ulrich Pohlmann , Thomas Heidrich

IPC: G01B15/00

Abstract: An overlay metrology system includes a particle-beam metrology tool to scan a particle beam across an overlay target on a sample including a first-layer target element and a second-layer target element. The overlay metrology system may further include a controller to receive a scan signal from the particle-beam metrology tool, determine symmetry measurements for the scan signal with respect to symmetry metrics, and generate an overlay measurement between the first layer and the second layer based on the symmetry measurements in which an asymmetry of the scan signal is indicative of a misalignment of the second-layer target element with respect to the first-layer target element and a value of the overlay measurement is based on the symmetry measurements.

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