知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

34 records (took 0.017 seconds)

    CIRCUIT BOARD ASSEMBLY HAVING OPTICAL TRANSCEIVERS FOR SIGNAL TRANSMISSION
    1.
    发明申请
    CIRCUIT BOARD ASSEMBLY HAVING OPTICAL TRANSCEIVERS FOR SIGNAL TRANSMISSION 失效
    具有用于信号传输的光收发器的电路板组件

    公开(公告)号：US20130302036A1

    公开(公告)日：2013-11-14

    申请号：US13564735

    申请日：2012-08-02

    Applicant: KAI-WEN WU

    Inventor： KAI-WEN WU

    IPC: H04B10/14

    CPC classification number: G02B6/43

    Abstract: A circuit board assembly includes a first circuit board, and a second circuit board, a first optical transceiver, a number of first light wave guides, a second optical transceiver, and a number of second light wave guides. The first circuit board defines a number of first through holes. The second circuit board defines a number of second and third through holes. Each of the third through holes is aligned with a respective first though hole. The first optical transceiver is optically coupled with the second through holes. The first light wave guides are mounted on one surface of the first circuit board and optically coupled with the second through holes. The second optical transceiver is optically coupled with the third through holes. The second light wave guides are mounted on another surface of the first circuit board and are optically coupled with the first through holes.

    Abstract translation: 电路板组件包括第一电路板和第二电路板，第一光收发器，多个第一光波导，第二光收发器和多个第二光波导。 第一个电路板定义了多个第一通孔。 第二电路板限定了多个第二和第三通孔。 每个第三通孔与相应的第一通孔对齐。 第一光收发器与第二通孔光学耦合。 第一光波导安装在第一电路板的一个表面上并与第二通孔光耦合。 第二光收发器与第三通孔光学耦合。 第二光波导安装在第一电路板的另一个表面上并与第一通孔光学耦合。

    OPTICAL FIBER CONNECTOR ASSEMBLY
    4.
    发明申请
    OPTICAL FIBER CONNECTOR ASSEMBLY 审中-公开
    光纤连接器总成

    公开(公告)号：US20120326014A1

    公开(公告)日：2012-12-27

    申请号：US13470373

    申请日：2012-05-14

    Applicant: KAI-WEN WU ,  YI-ZHONG SHEU

    Inventor： KAI-WEN WU ,  YI-ZHONG SHEU

    IPC: G01J1/42

    CPC classification number: G02B6/4249 ,  G02B6/4292

    Abstract: An optical fiber connector assembly includes an optical socket and an optical plug. The optical socket defines a recess, and a coupling surface in the recess, with light emitters and light detectors on the coupling surface. Each light emitter includes a light emitting surface exposed in the recess, and is configured for converting a first electrical signal into a first optical signal. Each light detector includes a light incident surface exposed in the recess, and is configured for converting a second optical signal into a second electrical signal. The optical plug can be inserted into the recess, and includes optical output fibers aligned with the light emitting surface for outputting the first optical signal from the light emitting surface, and optical input fibers aligned with the light incident surface for inputting the second optical signal to the light incident surface.

    Abstract translation: 光纤连接器组件包括光插座和光插头。 光学插座在凹槽中限定凹槽和耦合表面，在耦合表面上具有发光体和光检测器。 每个光发射器包括暴露在凹部中的发光表面，并且被配置为将第一电信号转换为第一光信号。 每个光检测器包括暴露在凹部中的光入射表面，并且被配置为将第二光信号转换为第二电信号。 光插头可以插入到凹部中，并且包括与发光表面对准的光输出光纤，用于从发光表面输出第一光信号，以及与光入射面对准的光输入光纤，用于将第二光信号输入到 光入射面。

    OPTICAL-ELECTRICAL CONVERTING DEVICE
    5.
    发明申请
    OPTICAL-ELECTRICAL CONVERTING DEVICE 有权
    光电转换器件

    公开(公告)号：US20130306837A1

    公开(公告)日：2013-11-21

    申请号：US13552659

    申请日：2012-07-19

    Applicant: KAI-WEN WU

    Inventor： KAI-WEN WU

    IPC: G01J1/04

    CPC classification number: H05K1/111 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y02P70/611

    Abstract: An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad.

    Abstract translation: 光电转换装置包括衬底，电路层，至少一个辅助衬垫和光电转换透镜。 电路层包括至少一个电路部分。 光电透镜包括至少一个第一支撑部分和至少一个第二支撑部分。 所述至少一个第一支撑部分中的每一个位于所述至少一个第一电路部分中的相应一个上，并且所述至少一个第二支撑部分中的每个位于所述至少一个辅助垫中的相应一个上。 电路层和至少一个辅助衬垫布置在衬底上。 至少一个第一电路部分层的厚度基本上等于至少一个辅助焊盘的厚度。

    OPTICAL-ELECTRICAL MODULE
    8.
    发明申请
    OPTICAL-ELECTRICAL MODULE 有权
    光电模块

    公开(公告)号：US20130146752A1

    公开(公告)日：2013-06-13

    申请号：US13446246

    申请日：2012-04-13

    Applicant: KAI-WEN WU

    Inventor： KAI-WEN WU

    IPC: H01L31/147 ,  H01S3/10

    CPC classification number: H01L31/147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/16152 ,  H01S5/02208 ,  H01S5/02288 ,  H01L2924/00014

    Abstract: An optical-electrical module includes a base board, a laser diode, an integrated circuit, and a lens unit. The laser diode and the integrated circuit are both fixed on the base board. The lens unit and the base board cooperatively define a receiving space to receive the laser diode and the integrated circuit. The laser diode has a transmitting window at an end of the laser diode away from the base board. The integrated circuit drives the laser diode to transmit optical signals. The lens unit has an inner surface facing the base board, and the inner surface of the lens unit has a light transmitting area. The lens unit includes a metal film formed on the inner surface of the lens unit except on the light transmitting area.

    Abstract translation: 光电模块包括基板，激光二极管，集成电路和透镜单元。 激光二极管和集成电路都固定在基板上。 透镜单元和基板协作地限定了接收激光二极管和集成电路的接收空间。 激光二极管在激光二极管的远离基板的一端具有发射窗口。 集成电路驱动激光二极管传输光信号。 透镜单元具有面向基板的内表面，并且透镜单元的内表面具有透光区域。 透镜单元包括形成在透镜单元的内表面上的除了透光区域之外的金属膜。

    OPTICAL FIBER COUPLING ASSEMBLY
    9.
    发明申请
    OPTICAL FIBER COUPLING ASSEMBLY 有权
    光纤耦合总成

    公开(公告)号：US20130142485A1

    公开(公告)日：2013-06-06

    申请号：US13337163

    申请日：2011-12-26

    Applicant: KAI-WEN WU

    Inventor： KAI-WEN WU

    IPC: G02B6/38

    CPC classification number: G02B6/32 ,  G02B6/3853 ,  G02B6/3882 ,  G02B6/3885

    Abstract: An optical fiber coupling assembly includes a first optical fiber connector and a second optical fiber connector. The first optical fiber connector includes a first body having a first light incident surface, first optical lenses, first plugs, and second plugs. The first optical lenses, the first plugs, and the second plugs are formed on the first light incident surface. The first optical lenses are positioned between the first plugs, and the first plugs are positioned between the second plugs. The second plugs are longer than the first plugs. The second optical fiber connector includes a second body having a second light incident surface and second optical lenses formed on the second light incident surface. First engaging holes and second engaging holes are defined in the second light incident surface. The first plugs are inserted into the first engaging holes, and the second plugs are inserted into the second engaging holes.

    Abstract translation: 光纤耦合组件包括第一光纤连接器和第二光纤连接器。 第一光纤连接器包括具有第一光入射表面的第一本体，第一光学透镜，第一插头和第二插头。 第一光学透镜，第一插头和第二插头形成在第一光入射表面上。 第一光学透镜位于第一插头之间，第一插头位于第二插头之间。 第二个插头比第一个插头长。 第二光纤连接器包括具有第二光入射表面的第二主体和形成在第二光入射表面上的第二光学透镜。 第一接合孔和第二接合孔限定在第二光入射表面中。 第一插头插入到第一接合孔中，第二插头插入到第二接合孔中。

    CHIP PACKAGE
    10.
    发明申请
    CHIP PACKAGE 审中-公开
    芯片包装

    公开(公告)号：US20130142479A1

    公开(公告)日：2013-06-06

    申请号：US13598810

    申请日：2012-08-30

    Applicant: KAI-WEN WU ,  TAI-CHERNG YU

    Inventor： KAI-WEN WU ,  TAI-CHERNG YU

    IPC: G02B6/12

    CPC classification number: G02B6/4201

    Abstract: A chip package includes a substrate, an electrical module, an optical module and a transmission module. The electrical module and the optical module are positioned on the substrate and electrically connect with each other. The optical module is used for converting optical signals to electrical signals, and vice versa. The optical module includes an optical emitting element and optical receiving element. The transmission module is positioned on the substrate. The transmission module includes an optical wave guide array having a reflection surface and a plurality of optical fibers that are optically coupled with the optical wave guide array. The optical signals emitted by the optical module are reflected by the reflection surface and reach the optical fibers to be transmitted; the optical module is capable of receiving optical signals from the optical fibers.

    Abstract translation: 芯片封装包括基板，电气模块，光学模块和传输模块。 电气模块和光学模块位于基板上并彼此电连接。 光模块用于将光信号转换为电信号，反之亦然。 光学模块包括发光元件和光学接收元件。 传输模块位于基板上。 传输模块包括具有反射表面的光波导阵列和与光波导阵列光学耦合的多个光纤。 由光学模块发射的光信号被反射面反射并到达要传输的光纤; 光模块能够从光纤接收光信号。

Patent Agency Ranking