公开(公告)号：US09590331B2

公开(公告)日：2017-03-07

申请号：US14799433

申请日：2015-07-14

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akira Tanaka ,  Masaya Hirashima ,  Satoru Yasui ,  Mayumi Machino

IPC: H01R13/62 ,  H01R12/70 ,  G06K7/04 ,  H01R13/24 ,  H01R12/71

CPC classification number: H01R12/7076 ,  G06K7/04 ,  H01R12/716 ,  H01R13/2464

Abstract: A card connector includes a base, a shell and a contact. The contact has a contact portion, a first elastic portion and a second elastic portion. The contact portion abuts an electrode of an IC card inserted into a slot between the base and the shell. The first elastic portion extends from the contact portion in an insertion direction of the IC card and has a first end fixed to the base. The second elastic portion extends from the contact portion in an ejection direction of the IC card and has a second end fixed to the base.

Abstract translation: 卡连接器包括基座，外壳和触点。 接触件具有接触部分，第一弹性部分和第二弹性部分。 接触部分邻接插入基座和壳体之间的槽中的IC卡的电极。 第一弹性部分沿着IC卡的插入方向从接触部分延伸，并且具有固定到基座的第一端。 第二弹性部分在IC卡的排出方向上从接触部分延伸，并且具有固定到基座的第二端。

公开(公告)号：US10233557B2

公开(公告)日：2019-03-19

申请号：US15065115

申请日：2016-03-09

Applicant: Kabushiki Kaisha Toshiba ,  TOKYO INSTITUTE OF TECHNOLOGY

Inventor： Kazuhito Higuchi ,  Yusaku Asano ,  Kyoko Honma ,  Kazuma Hiraguri ,  Yasunari Ukita ,  Masayuki Uchida ,  Toshiya Nakayama ,  Mayumi Machino ,  Masato Sone ,  Tso-Fu Mark Chang

IPC: C25D7/12 ,  C25D3/38 ,  C25D17/00 ,  C25D5/00 ,  C25D5/34

Abstract: An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

公开(公告)号：US20160273121A1

公开(公告)日：2016-09-22

申请号：US15065115

申请日：2016-03-09

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOKYO INSTITUTE OF TECHNOLOGY

Inventor： Kazuhito HIGUCHI ,  Yusaku Asano ,  Kyoko Honma ,  Kazuma Hiraguri ,  Yasunari Ukita ,  Masayuki Uchida ,  Toshiya Nakayama ,  Mayumi Machino ,  Masato Sone ,  Tso-Fu Mark Chang

IPC: C25D7/12 ,  C25D17/00 ,  C25D17/12 ,  C25D3/38 ,  C25D5/02

CPC classification number: C25D7/123 ,  C25D3/38 ,  C25D5/003 ,  C25D5/34 ,  C25D17/001

Abstract: An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

Abstract translation: 根据一个实施方式的电镀方法是通过将设置在反应槽中的阳极和阴极的阴极设置为负电位而在阴极表面上产生金属膜的电镀方法，包括混合并容纳至少包含至少 电镀金属离子，电解质，表面活性剂和超临界流体，并且施加浓度超过临界流体的电流和阴极电流密度，其中从阴极极化曲线获得的极化电阻同时电镀 金属离子的还原比超临界流体混合前要大。