公开(公告)号：US11570908B2

公开(公告)日：2023-01-31

申请号：US17248569

申请日：2021-01-29

Applicant: Juniper Networks, Inc.

Inventor： Steve M. Wilkinson ,  Daniel J. Prezioso

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/22 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H01L23/498

Abstract: A method may include obtaining a printed circuit board (PCB) that includes a set of vias that include a set of stub regions. The PCB may include a set of layers perpendicular to the set of vias. The set of layers may include a signal layer and a ground layer. The ground layer may be located between the set of stub regions and the signal layer. The method may include drilling to remove at least a portion of a stub region of a via of the set of vias. The method may include performing an electrical test to determine whether a sliver of conductive material is included within the via after drilling to remove the at least a portion of the stub region of the via.

公开(公告)号：US10917976B1

公开(公告)日：2021-02-09

申请号：US15647984

申请日：2017-07-12

Applicant: Juniper Networks, Inc.

Inventor： Steve M. Wilkinson ,  Daniel J. Prezioso

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H01L23/498 ,  H05K3/22

Abstract: A method may include obtaining a printed circuit board (PCB) that includes a set of vias that include a set of stub regions. The PCB may include a set of layers perpendicular to the set of vias. The set of layers may include a signal layer and a ground layer. The ground layer may be located between the set of stub regions and the signal layer. The method may include drilling to remove at least a portion of a stub region of a via of the set of vias. The method may include performing an electrical test to determine whether a sliver of conductive material is included within the via after drilling to remove the at least a portion of the stub region of the via.