公开(公告)号：US20120162788A1

公开(公告)日：2012-06-28

申请号：US12980261

申请日：2010-12-28

Applicant: Jing-En LUAN ,  Junyong CHEN

Inventor： Jing-En LUAN ,  Junyong CHEN

IPC: G02B7/02

CPC classification number: G02B7/023 ,  G02B7/025

Abstract: Lens alignment apparatuses, methods and optical devices are disclosed. In accordance with various embodiments, a lens alignment apparatus may include at least one lens element positioned in a lens body. A lens alignment interface coupled to the lens element may be configured to permit the lens element to be angularly deflected relative to an axis of symmetry of the lens body. In other embodiments, a method of improving the resolution of an optical device may include translating a lens along an optical axis to maximize resolution at a first location, and determining a resolution in a second location in the imaging plane. The resolution in the second location may be improved by angularly deflecting the lens, and the position of the lens may then be fixed.

Abstract translation: 公开了透镜对准装置，方法和光学装置。 根据各种实施例，透镜对准装置可以包括定位在透镜体中的至少一个透镜元件。 耦合到透镜元件的透镜对准接口可以被配置为允许透镜元件相对于透镜主体的对称轴线成角度地偏转。 在其他实施例中，改进光学装置的分辨率的方法可以包括沿着光轴平移透镜以使第一位置处的分辨率最大化，以及确定成像平面中第二位置的分辨率。 可以通过使透镜成角度地偏转来改善第二位置中的分辨率，然后可以固定透镜的位置。

公开(公告)号：US20120105713A1

公开(公告)日：2012-05-03

申请号：US12938235

申请日：2010-11-02

Applicant: Jing-En LUAN

Inventor： Jing-En LUAN

IPC: H04N5/225 ,  H05K13/00

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2251 ,  Y10T29/49002 ,  H01L2924/00

Abstract: A low profile chip scale module and method of making of the same. The low profile chip scale module includes embedded SMD and integrated EM shielding. An adhesive layer is arranged on a substrate, e.g., chip carrier. Dies and SMDs are arranged on the adhesive layer. An etched frame and molding is attached to the substrate. Inputs/outputs (I/O) are formed and the substrate is coated with a dielectric material. Metal lines and connections among bond pads are formed and another layer of dielectric material is applied as a protective layer. The substrate is cut into various predetermined sizes and a lens is attached to form the chip scale module.

Abstract translation: 一种低调的芯片规模模块及其制造方法。 低调芯片尺寸模块包括嵌入式SMD和集成EM屏蔽。 粘合剂层布置在基底上，例如芯片载体上。 模具和SMD布置在粘合剂层上。 将蚀刻的框架和模制件附接到基板。 形成输入/输出（I / O），并且用电介质材料涂覆基板。 形成金属线和接合焊盘之间的连接，另外施加介电材料层作为保护层。 将基板切割成各种预定尺寸，并且连接透镜以形成芯片刻度模块。