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公开(公告)号:US20220392790A1
公开(公告)日:2022-12-08
申请号:US17793380
申请日:2021-01-22
发明人: InWoo BACK , JongChul KIM , YeongSeop BYEON , InCheol YEO
IPC分类号: H01L21/67 , H01L21/687 , C23C16/458 , C23C16/44 , C23C16/52
摘要: The present inventive concept relates to a substrate processing apparatus and a spray module of the substrate processing apparatus, the substrate processing apparatus comprising: a chamber for providing a processing space; a lid for covering the upper portion of the chamber; a substrate support portion which supports at least one substrate and rotates about a rotary shaft; a gas spray portion which is above the substrate support portion in a diameter direction from the rotary shaft of the substrate support portion and which sprays a processing gas; and a measuring portion which is arranged to be in parallel with or to be inclined in a direction at a certain angle with respect to the diameter direction on a measurement position that is spaced apart from the diameter direction and which measures the temperature of the substrate supported by the substrate support portion or the temperature of the substrate support portion.