发明申请
- 专利标题: SUBSTRATE PROCESSING APPARATUS AND SPRAY MODULE OF SUBSTRATE PROCESSING APPARATUS
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申请号: US17793380申请日: 2021-01-22
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公开(公告)号: US20220392790A1公开(公告)日: 2022-12-08
- 发明人: InWoo BACK , JongChul KIM , YeongSeop BYEON , InCheol YEO
- 申请人: JUSUNG ENGINEERING CO., LTD.
- 申请人地址: KR Gwangju-si, Gyeonggi-do
- 专利权人: JUSUNG ENGINEERING CO., LTD.
- 当前专利权人: JUSUNG ENGINEERING CO., LTD.
- 当前专利权人地址: KR Gwangju-si, Gyeonggi-do
- 优先权: KR10-2020-0009353 20200123
- 国际申请: PCT/KR2021/000875 WO 20210122
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/687 ; C23C16/458 ; C23C16/44 ; C23C16/52
摘要:
The present inventive concept relates to a substrate processing apparatus and a spray module of the substrate processing apparatus, the substrate processing apparatus comprising: a chamber for providing a processing space; a lid for covering the upper portion of the chamber; a substrate support portion which supports at least one substrate and rotates about a rotary shaft; a gas spray portion which is above the substrate support portion in a diameter direction from the rotary shaft of the substrate support portion and which sprays a processing gas; and a measuring portion which is arranged to be in parallel with or to be inclined in a direction at a certain angle with respect to the diameter direction on a measurement position that is spaced apart from the diameter direction and which measures the temperature of the substrate supported by the substrate support portion or the temperature of the substrate support portion.
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