公开(公告)号：US11249398B2

公开(公告)日：2022-02-15

申请号：US16560020

申请日：2019-09-04

Applicant: JSR CORPORATION

Inventor： Hirokazu Sakakibara ,  Hirokazu Itou ,  Tomoyuki Matsumoto ,  Kazuto Watanabe

IPC: G03F7/20 ,  G03F7/004 ,  G03F7/027 ,  G03F7/09

Abstract: A method for producing a plated shaped structure, includes applying a photosensitive resin composition on a substrate to form a photosensitive resin coating film. The photosensitive resin composition includes: (A) a resin whose solubility in alkali is capable of being increased by an action of an acid; (B) a photoacid generator; and (C) a compound which is capable of being decomposed by an action of an acid to form a primary or secondary amine. The photosensitive resin coating film is exposed to light. The photosensitive resin coating film is developed after the exposing to light to form a resist pattern. A plating process is performed using the resist pattern as a mask.

公开(公告)号：US12174538B2

公开(公告)日：2024-12-24

申请号：US17435408

申请日：2020-03-19

Applicant: JSR CORPORATION

Inventor： Naoki Nishiguchi ,  Tomoyuki Matsumoto ,  Ayako Endo

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40

Abstract: A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.

公开(公告)号：US20190391489A1

公开(公告)日：2019-12-26

申请号：US16560020

申请日：2019-09-04

Applicant: JSR Corporation

Inventor： Hirokazu Sakakibara ,  Hirokazu Itou ,  Tomoyuki Matsumoto ,  Kazuto Watanabe

IPC: G03F7/004 ,  G03F7/027 ,  G03F7/09 ,  G03F7/20

Abstract: A method for producing a plated shaped structure, includes applying a photosensitive resin composition on a substrate to form a photosensitive resin coating film. The photosensitive resin composition includes: (A) a resin whose solubility in alkali is capable of being increased by an action of an acid; (B) a photoacid generator; and (C) a compound which is capable of being decomposed by an action of an acid to form a primary or secondary amine. The photosensitive resin coating film is exposed to light. The photosensitive resin coating film is developed after the exposing to light to form a resist pattern. A plating process is performed using the resist pattern as a mask.

公开(公告)号：US12158700B2

公开(公告)日：2024-12-03

申请号：US17269021

申请日：2019-06-14

Applicant: JSR CORPORATION

Inventor： Hirokazu Sakakibara ,  Naoki Nishiguchi ,  Takuhiro Taniguchi ,  Tomoyuki Matsumoto

IPC: G03F7/038 ,  C08F220/18 ,  C08F220/28 ,  C25D3/12 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  G03F7/004 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40

Abstract: The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3), and a photoacid generator (B). In the formulae (a1) to (a3), R12, R22, and R32 each independently represent an organic group having 1 to 10 carbon atoms; R21 represents a substituted or non-substituted alkyl group having 1 to 10 carbon atoms; R31 represents a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atoms, or a halogen atom; R13 and R23 each independently represent an acid dissociable group; R33 represents a hydroxyaryl group; and l, m and n independently represent an integer from 0 to 10.