公开(公告)号：US20190391489A1

公开(公告)日：2019-12-26

申请号：US16560020

申请日：2019-09-04

Applicant: JSR Corporation

Inventor： Hirokazu Sakakibara ,  Hirokazu Itou ,  Tomoyuki Matsumoto ,  Kazuto Watanabe

IPC: G03F7/004 ,  G03F7/027 ,  G03F7/09 ,  G03F7/20

Abstract: A method for producing a plated shaped structure, includes applying a photosensitive resin composition on a substrate to form a photosensitive resin coating film. The photosensitive resin composition includes: (A) a resin whose solubility in alkali is capable of being increased by an action of an acid; (B) a photoacid generator; and (C) a compound which is capable of being decomposed by an action of an acid to form a primary or secondary amine. The photosensitive resin coating film is exposed to light. The photosensitive resin coating film is developed after the exposing to light to form a resist pattern. A plating process is performed using the resist pattern as a mask.

公开(公告)号：US11249398B2

公开(公告)日：2022-02-15

申请号：US16560020

申请日：2019-09-04

Applicant: JSR CORPORATION

Inventor： Hirokazu Sakakibara ,  Hirokazu Itou ,  Tomoyuki Matsumoto ,  Kazuto Watanabe

IPC: G03F7/20 ,  G03F7/004 ,  G03F7/027 ,  G03F7/09

Abstract: A method for producing a plated shaped structure, includes applying a photosensitive resin composition on a substrate to form a photosensitive resin coating film. The photosensitive resin composition includes: (A) a resin whose solubility in alkali is capable of being increased by an action of an acid; (B) a photoacid generator; and (C) a compound which is capable of being decomposed by an action of an acid to form a primary or secondary amine. The photosensitive resin coating film is exposed to light. The photosensitive resin coating film is developed after the exposing to light to form a resist pattern. A plating process is performed using the resist pattern as a mask.