公开(公告)号：US20120180318A1

公开(公告)日：2012-07-19

申请号：US13349043

申请日：2012-01-12

申请人： Isao Seki ,  Hisanobu Watanabe ,  Yuichi I ,  Takayuki Matsuura

发明人： Isao Seki ,  Hisanobu Watanabe ,  Yuichi I ,  Takayuki Matsuura

IPC分类号： B26B11/00

CPC分类号： B23K9/0052 ,  B23K9/08 ,  B23K31/12 ,  B23K31/125 ,  B23K2101/06 ,  B25J5/00 ,  B25J11/005 ,  B25J19/02 ,  G21C17/017 ,  G21C19/207 ,  G21C21/00

摘要： A nuclear power plant construction preparation unit includes: a device main body which enters into a space; a moving part which causes the device main body to enter into the space; an eddy-current inspection sensor which is provided on the device main body, and which detects a target portion of a member surface within the space; a punch marking part which is provided on the device main body, and which performs marking on the member surface; and a control part which controls the moving part and the marking device based on detection results from the target portion detection device, to thereby perform marking at a relative position with respect to the target portion.

摘要翻译： 核电厂建设准备单元包括：进入空间的装置主体; 使装置主体进入空间的移动部; 涡流检查传感器，其设置在所述装置主体上，并且检测所述空间内的构件表面的目标部分; 冲压标记部，其设置在所述装置主体上，并且在所述构件表面上进行标记; 以及控制部，其基于来自所述目标部位检测装置的检测结果来控制所述移动部和所述标记装置，从而在相对于所述目标部的相对位置进行标记。

公开(公告)号：US09205507B2

公开(公告)日：2015-12-08

申请号：US13349043

申请日：2012-01-12

申请人： Isao Seki ,  Hisanobu Watanabe ,  Yuichi I ,  Takayuki Matsuura

发明人： Isao Seki ,  Hisanobu Watanabe ,  Yuichi I ,  Takayuki Matsuura

IPC分类号： G06F19/00 ,  B23K9/00 ,  B23K31/12 ,  B23K9/08

CPC分类号： B23K9/0052 ,  B23K9/08 ,  B23K31/12 ,  B23K31/125 ,  B23K2101/06 ,  B25J5/00 ,  B25J11/005 ,  B25J19/02 ,  G21C17/017 ,  G21C19/207 ,  G21C21/00

摘要： A nuclear power plant construction preparation unit includes: a device main body which enters into a space; a moving part which causes the device main body to enter into the space; an eddy-current inspection sensor which is provided on the device main body, and which detects a target portion of a member surface within the space; a punch marking part which is provided on the device main body, and which performs marking on the member surface; and a control part which controls the moving part and the marking device based on detection results from the target portion detection device, to thereby perform marking at a relative position with respect to the target portion.

摘要翻译： 核电厂建设准备单元包括：进入空间的装置主体; 使装置主体进入空间的移动部; 涡流检查传感器，其设置在所述装置主体上，并且检测所述空间内的构件表面的目标部分; 冲压标记部，其设置在所述装置主体上，并且在所述构件表面上进行标记; 以及控制部，其基于来自所述目标部位检测装置的检测结果来控制所述移动部和所述标记装置，从而在相对于所述目标部的相对位置进行标记。

公开(公告)号：US20120177165A1

公开(公告)日：2012-07-12

申请号：US13344043

申请日：2012-01-05

申请人： Naoto Kawase ,  Isao Seki ,  Takayuki Matsuura

发明人： Naoto Kawase ,  Isao Seki ,  Takayuki Matsuura

IPC分类号： G21C17/017 ,  F16L9/00 ,  B23K31/12

CPC分类号： G21C17/017 ,  G01N29/04 ,  G01N29/043 ,  G01N2223/646 ,  G01N2291/267 ,  G01N2291/2675 ,  G21C21/00

摘要： A construction method of a pipeline that forms a pipeline by joining tubular members to each other by butt welding, includes: a tubular member preparation step for preparing a tubular member having a smooth length of an outer surface along an axial direction from a joined end, which is set based on conditions of ultrasonic inspection of a welded portion, which are determined by usage conditions of the pipeline; a tubular member welding step for welding together prepared tubular members; and a welded portion inspection step for inspecting a welded portion by ultrasonic inspection.

摘要翻译： 通过对接焊接将管状构件相互连接而形成管道的管道的施工方法包括：管状构件准备步骤，用于从接合端制备沿着轴向具有平滑长度的外表面的管状构件， 其基于由管道的使用条件确定的焊接部的超声波检查的条件设定; 用于将准备的管状构件焊接在一起的管状构件焊接步骤; 以及焊接部检查工序，用于通过超声波检查来检查焊接部。

公开(公告)号：US06511560B2

公开(公告)日：2003-01-28

申请号：US09834602

申请日：2001-04-16

申请人： Isao Seki ,  Shigeo Hama ,  Shigehiro Taniike ,  Fukashi Watanabe ,  Masahiko Kakizaki ,  Shinji Seki

发明人： Isao Seki ,  Shigeo Hama ,  Shigehiro Taniike ,  Fukashi Watanabe ,  Masahiko Kakizaki ,  Shinji Seki

IPC分类号： C22F106

CPC分类号： B21K23/00 ,  B21J5/02 ,  B21K21/02 ,  H05K5/02 ,  Y10T428/12361 ,  Y10T428/12375 ,  Y10T428/12382 ,  Y10T428/12389 ,  Y10T428/12993 ,  Y10T428/31681

摘要： A thin, forged magnesium alloy casing is integrally constituted by a thin plate with projections on either or both surfaces, and the thin plate is as thin as about 1.5 mm or less. The thin forged casing can be produced by (a) carrying out a first forging step for roughly forging a magnesium alloy plate to form an intermediate forged product under the conditions of a preheating temperature of the magnesium alloy plate of 350-500° C., a die temperature of 350-450° C., a compression pressure of 3-30 tons/cm2, a compressing speed of 10-500 mm/sec. and a compression ratio of 75% or less; and (b) carrying out a second forging step for precisely forging the intermediate forged product under the conditions of a preheating temperature of the intermediate forged product of 300-500° C., a die temperature of 300-400° C., a compression pressure of 1-20 tons/cm2, a compressing speed of 1-200 mm/sec., and a compression ratio of 30% or less.

摘要翻译： 薄的锻造的镁合金外壳由在一个或两个表面上具有突起的薄板一体地构成，并且薄板薄至约1.5mm或更小。 可以通过（a）在镁合金板的预热温度为350〜500℃的条件下，进行大致锻造镁合金板以形成中间锻造品的第一锻造工序来制造薄型锻造套管， 模具温度为350-450℃，压缩压力为3-30吨/厘米2，压缩速度为10-500毫米/秒。 压缩比为75％以下; 和（b）进行第二锻造工序，在中间锻造品的预热温度为300〜500℃，模具温度为300〜400℃的条件下精密锻造中间锻造品，压缩 压力为1-20吨/ cm2，压缩速度为1-200mm / sec，压缩比为30％以下。

公开(公告)号：US06316129B1

公开(公告)日：2001-11-13

申请号：US09275003

申请日：1999-03-24

申请人： Isao Seki ,  Shigeo Hama ,  Shigehiro Tanike ,  Fukashi Watanabe ,  Masahiko Kakizaki ,  Shinji Seki

发明人： Isao Seki ,  Shigeo Hama ,  Shigehiro Tanike ,  Fukashi Watanabe ,  Masahiko Kakizaki ,  Shinji Seki

IPC分类号： H05K504

CPC分类号： B21K23/00 ,  B21J5/02 ,  B21K21/02 ,  H05K5/02 ,  Y10T428/12361 ,  Y10T428/12375 ,  Y10T428/12382 ,  Y10T428/12389 ,  Y10T428/12993 ,  Y10T428/31681

摘要： A thin, forged magnesium alloy casing is integrally constituted by a thin plate with projections on either or both surfaces, and the thin plate is as thin as about 1.5 mm or less. The thin forged casing can be produced by (a) carrying out a first forging step for roughly forging a magnesium alloy plate to form an intermediate forged product under the conditions of a preheating temperature of the magnesium alloy plate of 350-500° C., a die temperature of 350-450° C., a compression pressure of 3-30 tons/cm2, a compressing speed of 10‥500 mm/sec. and a compression ratio of 75% or less; and (b) carrying out a second forging step for precisely forging the intermediate forged product under the conditions of a preheating temperature of the intermediate forged product of 300-500° C., a die temperature of 300-400° C., a compression pressure of 1-20 tons/cm2, a compressing speed of 1-200 mm/sec., and a compression ratio of 30% or less.

摘要翻译： 薄的锻造的镁合金外壳由在一个或两个表面上具有突起的薄板一体地构成，并且薄板薄至约1.5mm或更小。 可以通过（a）在镁合金板的预热温度为350〜500℃的条件下，进行大致锻造镁合金板以形成中间锻造品的第一锻造工序来制造薄型锻造套管， 模具温度为350-450℃，压缩压力为3-30吨/厘米2，压缩速度为10‥500毫米/秒。 压缩比为75％以下; 和（b）进行第二锻造工序，在中间锻造品的预热温度为300〜500℃，模具温度为300〜400℃的条件下精密锻造中间锻造品，压缩 压力为1-20吨/ cm2，压缩速度为1-200mm / sec，压缩比为30％以下。

公开(公告)号：US06875639B2

公开(公告)日：2005-04-05

申请号：US10091426

申请日：2002-03-07

申请人： Hiroshi Arai ,  Nobuaki Nagashima ,  Norihiko Kasai ,  Isao Seki

发明人： Hiroshi Arai ,  Nobuaki Nagashima ,  Norihiko Kasai ,  Isao Seki

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/56 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip has a quadrangle main surface, a wiring substrate, and a resin seal member for sealing the semiconductor chip, in which the resin seal member has a quadrangle main surface which confronts the main surface of the semiconductor chip. A gate cut trace portion is formed on a side face extending along a first side of the main surface of the resin seal member. A sectional area of an area between the main surface of the wiring substrate and the main surface of the resin seal member at a position outside a side face of the semiconductor chip is smaller than a sectional area of an area between the main surface of the semiconductor chip and the main surface of the resin seal member.

摘要翻译： 半导体芯片具有四边形主表面，布线基板和用于密封半导体芯片的树脂密封构件，其中树脂密封构件具有面对半导体芯片的主表面的四边形主表面。 在沿着树脂密封构件的主表面的第一侧延伸的侧面上形成有切口迹线部分。 在半导体芯片的侧面外的位置处，布线基板的主面与树脂密封部件的主面之间的面积的截面积小于半导体芯片的主面的面积的截面积 芯片和树脂密封件的主表面。

公开(公告)号：US4076814A

公开(公告)日：1978-02-28

申请号：US690863

申请日：1976-05-28

申请人： Isao Seki ,  Noritoshi Kitano ,  Fusao Kondo

发明人： Isao Seki ,  Noritoshi Kitano ,  Fusao Kondo

IPC分类号： C07D207/16 ,  C07D213/50 ,  C07D295/088 ,  C07D295/21 ,  C07D309/40 ,  C07D493/10 ,  A61K31/535 ,  A61K31/54

CPC分类号： C07D295/088 ,  C07D207/16 ,  C07D213/50 ,  C07D295/21 ,  C07D309/40 ,  C07D493/10

摘要： Use of dithiocarbamic acid derivatives having the structure ##STR1## in which R.sub.1, R.sub.2 and R.sub.3 are various organic radicals as preventive and curative agents against mycoplasmosis. These derivatives are prepared from the starting materials having the structure ##STR2## by reaction with carbon disulfide or from the starting materials having the structure ##STR3## BY REACTION WITH R.sub.3 -halide.

摘要翻译： 使用具有结构“IMAGE”的二硫代氨基甲酸衍生物，其中R1，R2和R3是各种有机基团，作为抗支原体的预防和治疗剂。 这些衍生物由具有结构“IMAGE”的原料通过与二硫化碳反应或从具有通过与R 3卤化物反应的结构起始物质制备。