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Patent Agency Ranking
1.发明申请CLEANING COMPOSITION AND PROCESS FOR CLEANING SEMICONDUCTOR DEVICES AND/OR TOOLING DURING MANUFACTURING THEREOF 有权清洁组合物和清洁半导体器件和/或其制造过程中的清洁公开(公告)号：US20140128307A1
公开(公告)日：2014-05-08
申请号：US13669627
申请日：2012-11-06
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Vishal Chhabra , Laertis Economikos , John A. Fitzsimmons , James Hannah , Mahmoud Khojasteh , Jennifer Muncy
CPC classification number: H01L21/02057 , C11D3/042 , C11D3/2079 , C11D3/2086 , C11D7/08 , C11D7/265 , C11D7/267 , C11D11/0047
Abstract: Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.
Abstract translation: 用于在制造过程中清洁半导体器件或半导体工具的清洁溶液和工艺通常包括使半导体器件或半导体工具与不含氟化合物的酸性含水清洁溶液接触，所述酸性含水清洁溶液包含至少一种抗氧化剂和至少一种抗氧化剂 非氧化性酸。
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公开(公告)号：US20160041471A1
公开(公告)日：2016-02-11
申请号：US14453882
申请日：2014-08-07
Applicant: International Business Machines Corporation
Inventor： Guillaume D. Briend , Vishal Chhabra , John A. Fitzsimmons
IPC: G03F7/40
CPC classification number: G03F7/405
Abstract: The present invention relates generally to semiconductor fabrication lithography and, more particularly, to a method and composition for reducing post-development defects and residues that may remain on a photoresist after development of the photoresist without causing substantial damage to the photoresist. The method may include rinsing the photoresist and the semiconductor device with ozonated acidified conductive water composed of a combination of ozone and a gaseous acid dissolved in deionized water.
Abstract translation: 本发明一般涉及半导体制造光刻术，更具体地说，涉及一种减少显影后缺陷的残留物和残余物的方法和组合物，其可以在光致抗蚀剂显影之后保留在光致抗蚀剂上而不会对光致抗蚀剂造成实质的损害。 该方法可以包括用由臭氧和溶解在去离子水中的气态的组合组成的臭氧化的酸化导电水冲洗光致抗蚀剂和半导体器件。
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3.发明申请CLEANING COMPOSITION AND PROCESS FOR CLEANING SEMICONDUCTOR DEVICES AND/OR TOOLING DURING MANUFACTURING THEREOF 审中-公开清洁组合物和清洁半导体器件和/或其制造过程中的清洁公开(公告)号：US20150024989A1
公开(公告)日：2015-01-22
申请号：US14510381
申请日：2014-10-09
Applicant: International Business Machines Corporation
Inventor： Vishal Chhabra , Laertis Economikos , John A. Fitzsimmons , James Hannah , Mahmoud Khojasteh , Jennifer Muncy
CPC classification number: H01L21/02057 , C11D3/042 , C11D3/2079 , C11D3/2086 , C11D7/08 , C11D7/265 , C11D7/267 , C11D11/0047
Abstract: Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.
Abstract translation: 用于在制造过程中清洁半导体器件或半导体工具的清洁溶液和工艺通常包括使半导体器件或半导体工具与不含氟化合物的酸性含水清洁溶液接触，所述酸性含水清洁溶液包含至少一种抗氧化剂和至少一种抗氧化剂 非氧化性酸。
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4.发明授权Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof 有权用于清洁半导体器件的清洁组合物和工艺和/或其制造过程中的工具公开(公告)号：US09058976B2
公开(公告)日：2015-06-16
申请号：US13669627
申请日：2012-11-06
Applicant: International Business Machines Corporation
Inventor： Vishal Chhabra , Laertis Economikos , John A. Fitzsimmons , James Hannah , Mahmoud Khojasteh , Jennifer Muncy
CPC classification number: H01L21/02057 , C11D3/042 , C11D3/2079 , C11D3/2086 , C11D7/08 , C11D7/265 , C11D7/267 , C11D11/0047
Abstract: Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.
Abstract translation: 用于在制造过程中清洁半导体器件或半导体工具的清洁溶液和工艺通常包括使半导体器件或半导体工具与不含氟化合物的酸性含水清洁溶液接触，所述酸性含水清洁溶液包含至少一种抗氧化剂和至少一种抗氧化剂 非氧化性酸。
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5.发明授权Process for cleaning semiconductor devices and/or tooling during manufacturing thereof 有权在制造半导体器件和/或工具时清洁半导体器件的工艺公开(公告)号：US08647445B1
公开(公告)日：2014-02-11
申请号：US13669651
申请日：2012-11-06
Applicant: International Business Machines Corporation
Inventor： Vishal Chhabra , John A. Fitzsimmons , Mahmoud Khojasteh , Jennifer Muncy
IPC: B08B3/04
CPC classification number: H01L21/02057 , B24B53/017 , H01L21/02052
Abstract: Cleaning processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an antioxidant to form an insoluble adduct followed by solubilizing the adduct with a basic aqueous cleaning solution.
Abstract translation: 在制造过程中清洁半导体器件或半导体工具的清洁方法通常包括使半导体器件或半导体工具与抗氧化剂接触以形成不溶性加合物，然后用碱性水性清洁溶液溶解加合物。
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