摘要:
A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.
摘要:
Method and apparatus to prevent disturbances on the system power busses in a data processing system while communication channels of the system are partitioned and redundant to eliminate interruptions. Power to Direct Access Storage Devices (DASD) and Terminators are powered-on in a slow controlled manner to prevent disturbances on the power busses. This allows for hot plugging of DASD backplanes. Very fast (1u sec.) soft switch circuits along with parasitic (Lparx) storage components provide over current protection from any shorting component or disk drive.
摘要:
A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the EMC gasket therebetween.
摘要:
An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.
摘要:
A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.
摘要:
A solid state circuit breaker is disclosed for use in connection with a voltage bus, the voltage bus supplying electrical current to a load. The solid state circuit breaker includes a current controller for controlling the magnitude of current supplied by the voltage bus. A first current sensor senses the magnitude of the electrical current supplied by the voltage bus, the first current sensor having an output in communication with the current controller. An inductor is included within the first current sensor, the inductor providing a back electromotive force on the voltage bus. The back electromotive force is proportional to the rate of change of current flowing through the voltage bus.