Computer apparatus assembled wirelessly
    1.
    发明申请
    Computer apparatus assembled wirelessly 失效
    电脑装置无线组装

    公开(公告)号:US20040257762A1

    公开(公告)日:2004-12-23

    申请号:US10462750

    申请日:2003-06-17

    发明人: Shoei-Yuan Shih

    IPC分类号: G06F001/20

    CPC分类号: G06F1/183

    摘要: A computer apparatus assembled wirelessly includes electronic base members assembled in the computer apparatus that are coupled with one another to establish electric connection through connectors and connection ports to replace connection cables thereby to shrink the size of the entire computer apparatus and improve the convenience of repairs and replacement.

    摘要翻译: 组装在无线中的计算机装置包括组装在计算机设备中的彼此耦合的电子基座构件,以通过连接器和连接端口建立电连接,以代替连接电缆,从而缩小整个计算机设备的尺寸并提高修理的便利性, 替代。

    COOL AIR-SUPPLYING DEVICE FOR A COMPUTER SYSTEM
    2.
    发明申请
    COOL AIR-SUPPLYING DEVICE FOR A COMPUTER SYSTEM 有权
    用于计算机系统的冷却空气供应装置

    公开(公告)号:US20040228085A1

    公开(公告)日:2004-11-18

    申请号:US10249891

    申请日:2003-05-15

    IPC分类号: G06F001/20

    CPC分类号: G06F1/203

    摘要: A cool air-supplying device for a computer system. The computer system includes a computer apparatus and the computer apparatus includes a housing. The cool air-supplying device includes a casing connected to the housing of the computer system. The casing has an intake vent for receiving air and an outlet vent for outputting air. The cool air-supplying device further includes a thermoelectric cooler for cooling refrigerantwithin a heat pipe, the heat pipe installed inside the casing for transferring refrigerant cooled by the thermoelectric cooler to the outlet vent. A first fan installed at one end of the heat pipe transfers air cooled by the heat pipe to the housing of the computer system via the outlet vent.

    摘要翻译: 一种用于计算机系统的冷空气供应装置。 计算机系统包括计算机装置,计算机装置包括壳体。 冷气供给装置包括连接到计算机系统的壳体的壳体。 壳体具有用于接收空气的进气口和用于输出空气的出口。 冷空气供给装置还包括用于在热管中冷却制冷剂的热电冷却器,该热管安装在壳体内部,用于将由热电冷却器冷却的制冷剂输送到出口。 安装在热管一端的第一风扇通过出风口将由热管冷却的空气传送到计算机系统的壳体。

    Heat sink and package surface design
    3.
    发明申请
    Heat sink and package surface design 有权
    散热片和包装表面设计

    公开(公告)号:US20040218354A1

    公开(公告)日:2004-11-04

    申请号:US10857298

    申请日:2004-05-28

    申请人: Intel Corporation

    IPC分类号: G06F001/20

    摘要: An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package.

    摘要翻译: 一种电子组件,其包括散热器,热界面材料,集成电路和连接到集成电路的封装。 热界面材料位于包装上的第一表面和散热器上的第二表面之间,以改善包装和散热器之间的导热性。 第一表面和第二表面中的至少一个包括当散热器相对于封装被压缩时捕获多余的热界面材料的空腔。

    Method for combined air and liquid cooling of stacked electronics components
    4.
    发明申请
    Method for combined air and liquid cooling of stacked electronics components 有权
    堆叠电子元件组合空气和液体冷却方法

    公开(公告)号:US20040190247A1

    公开(公告)日:2004-09-30

    申请号:US10812694

    申请日:2004-03-30

    IPC分类号: G06F001/20 H05K005/00

    CPC分类号: H05K7/20754

    摘要: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.

    摘要翻译: 机壳设备提供机架安装的堆叠式电子部件的组合的空气和液体冷却。 热交换器安装在堆叠的电子设备的侧面上,空气在壳体内侧向流动,由安装在电子设备后面的气动装置推动。 辅助气动装置可以安装在外壳内以增加气流。 在替代实施例中,空气到液体的热交换器跨过外壳的前部和后部设置,并且封闭的空气流动回路由会聚的供气室,电子抽屉产生,空气通过空气移动装置引导, 发散的回风室,底部有一个连接管。 在该实施例的变型中,连接管道位于顶部和底部,并且供应和返回管道分别是双收敛和双重发散的。 可以添加辅助鼓风机以增加总系统空气流量。 外壳还可以设置有自动打开的通气面板,以允许室内空气在过温情况下循环和冷却。 外壳的设计允许其与机架安装的设备分开构造,并且如果需要,则在机架先前已经操作的设施处随后附接到机架上。

    Computer radiation module
    5.
    发明申请
    Computer radiation module 审中-公开
    计算机辐射模块

    公开(公告)号:US20040190242A1

    公开(公告)日:2004-09-30

    申请号:US10394156

    申请日:2003-03-24

    发明人: Kuang-Yao Lee

    IPC分类号: G06F001/20

    CPC分类号: G06F1/20

    摘要: A computer radiation module located between a central processor and a power supply includes a first radiation plate, a second radiation plate and a transfer member connecting to the first radiation plate and the second radiation plate. The first radiation plate and the transfer member transfer heat generated by the central processor to an air fan, and the second radiation plate transfers heat generated by the power supply to the air fan. Thus the heat generated by the central processor and the power supply are gathered and discharged effectively.

    摘要翻译: 位于中央处理器和电源之间的计算机辐射模块包括第一辐射板,第二辐射板和连接到第一辐射板和第二辐射板的传送构件。 第一辐射板和传递部件将由中央处理器产生的热量传递给风扇,第二辐射板将由电源产生的热量传递给风扇。 因此,中央处理器和电源产生的热量有效收集和排出。

    Method and system for a heat sink integrated in a wall of a computing device
    6.
    发明申请
    Method and system for a heat sink integrated in a wall of a computing device 审中-公开
    集成在计算设备的墙壁上的散热器的方法和系统

    公开(公告)号:US20040160740A1

    公开(公告)日:2004-08-19

    申请号:US10367446

    申请日:2003-02-14

    发明人: Prosenjit Ghosh

    CPC分类号: H05K7/20445 G06F1/203

    摘要: A method and system for a heat sink integrated in a wall of a computing device is described. The computing device includes a heat sink integrated in a wall of the computing device, and a heat conduit to transfer heat generated by a heat source to the heat sink. The heat sink allows ambient air external to the computing device to flow into the computing device to cool the transferred heat from the heat source.

    摘要翻译: 描述了集成在计算设备的壁中的散热器的方法和系统。 计算设备包括集成在计算设备的壁中的散热器和将热源产生的热量传递到散热器的热导管。 散热器允许计算设备外部的环境空气流入计算设备以冷却来自热源的传送的热量。

    Heat dissipation from a hand-held portable computer
    7.
    发明申请
    Heat dissipation from a hand-held portable computer 有权
    手持便携式电脑散热

    公开(公告)号:US20040130869A1

    公开(公告)日:2004-07-08

    申请号:US10338761

    申请日:2003-01-07

    IPC分类号: G06F001/20

    摘要: Heat is removed from a small hand-held portable computer by dissipating the heat from surfaces that are not typically held by the user during hand-held operation. The heat is dissipated from fins located at a rear underside casing of the portable computer. Heat-generating internal electronic components or their heat sinks are placed in close proximity to the fins. Heat may also be dissipated from the backside of the display screen. The dissipation of the heat allows the portable computer to operate at higher frequencies.

    摘要翻译: 通过在手持操作期间从通常不被用户握持的表面散发热量,从小型手持便携式计算机中去除热量。 热量从位于便携式计算机的后下壳体上的散热片散出。 产生热量的内部电子部件或其散热器被放置成紧靠翅片。 热量也可以从显示屏的背面消散。 热耗散使便携式计算机在较高频率下工作。

    Partition for varying the supply of cooling fluid
    8.
    发明申请
    Partition for varying the supply of cooling fluid 有权
    用于改变冷​​却液供应的分区

    公开(公告)号:US20040109288A1

    公开(公告)日:2004-06-10

    申请号:US10303761

    申请日:2002-11-26

    摘要: In a data center, a plurality of racks are cooled by activating a cooling device and opening a controllable partition configured to vary a supply of cooling fluid within a zone of the data center. The zone includes at least one associated rack of the plurality of racks. In addition, the temperature of at least one associated rack is sensed and it is determined whether the sensed temperature is within a predetermined temperature range. Furthermore, the controllable partition is manipulated to vary the supply of the cooling fluid to the zone in response to the sensed temperature being outside the predetermined temperature range.

    摘要翻译: 在数据中心中,多个机架通过启动冷却装置而被冷却,并且打开一个可控制的分区,该可分区被配置为改变数据中心区域内的冷却流体的供应。 该区域包括多个机架中的至少一个相关联的机架。 此外,感测至少一个相关联的架的温度,并且确定所感测的温度是否在预定的温度范围内。 此外,可控分区被操纵以响应于感测到的温度在预定温度范围之外而改变到区域的冷却流体的供应。

    SERVER BLADE CHASSIS WITH AIRFLOW BYPASS DAMPER ENGAGING UPON BLADE REMOVAL
    9.
    发明申请
    SERVER BLADE CHASSIS WITH AIRFLOW BYPASS DAMPER ENGAGING UPON BLADE REMOVAL 有权
    服务器叶片底盘与气流旁路阻尼器接合去除叶片

    公开(公告)号:US20040100765A1

    公开(公告)日:2004-05-27

    申请号:US10306302

    申请日:2002-11-27

    IPC分类号: G06F001/20 F28F007/00

    摘要: A server blade system includes a plurality of slots for receiving server blades. The system includes an air moving device to move air through each of the server blades installed in the system. When one of the server blades is removed, a bypass damper rotates into the empty slot to obstruct the flow of air through the slot. The bypass damper is pivotally mounted within each slot and includes a torsion spring to move the damper into the obstruction position. Two hinge pin mounts, which are nullUnull shaped in cross section, provide a snap fit for two hinge pins positioned at one end of the bypass damper. A spring mounting pin is positioned between the two hinge pins and a torsion spring is mounted over the spring mounting pin.

    摘要翻译: 服务器刀片系统包括用于接收服务器刀片的多个槽。 该系统包括空气移动装置,以将空气移动通过安装在系统中的每个服务器刀片。 当其中一个服务器刀片被卸下时,旁路阻尼器旋转到空槽中以阻止空气流过该槽。 旁通阻尼器枢转地安装在每个槽内,并且包括扭转弹簧以将阻尼器移动到阻塞位置。 横截面为“U”形的两个铰链销安装件为位于旁路阻尼器一端的两个铰链销提供卡扣配合。 弹簧安装销位于两个铰链销之间,扭簧安装在弹簧安装销上。

    Cooling apparatus having an electronic fan for cooling an electronic apparatus
    10.
    发明申请
    Cooling apparatus having an electronic fan for cooling an electronic apparatus 有权
    具有用于冷却电子设备的电子风扇的冷却装置

    公开(公告)号:US20040080909A1

    公开(公告)日:2004-04-29

    申请号:US10728149

    申请日:2003-12-04

    发明人: Chihel Kitahara

    IPC分类号: G06F001/20

    摘要: A cooling apparatus includes a cooling module having an electrically-driven cooling device. The cooling module is adapted to couple with a portable electronic apparatus having a heat generating component and a first connector to supply power. A second connector is provided to be electrically connected to the cooling device. The second connector is connected to the first connector when it is coupled with the portable electronic apparatus to supply the cooling device with the power received from the first connector.

    摘要翻译: 冷却装置包括具有电驱动冷却装置的冷却模块。 冷却模块适于与具有发热部件和第一连接器的便携式电子设备耦合以供电。 第二连接器设置成电连接到冷却装置。 当与便携式电子设备耦合时,第二连接器连接到第一连接器,以向冷却装置提供从第一连接器接收的电力。